Bearing Substrate Binding Assembly for Thermal Expansion Alignment
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Solution Overview
Problem
In display panel technology, substrates with different thermal expansion coefficients result in misaligned binding terminals due to thermal pressing, leading to poor binding effects between the display panel and on-chip film.
Innovation Solution
A bearing substrate with a higher thermal expansion coefficient than the integrated substrate is designed with first binding terminal sets having smaller distances between adjacent terminals, aligned and heated to align with second binding terminals on the integrated substrate, ensuring precise binding through pre-compression and thermal expansion compensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal pressing technology is used to bind substrates with different thermal expansion coefficients, then the binding process can be completed, but the binding terminals become misaligned and the binding effect deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-adjusting the spacing between binding terminals on the bearing substrate before thermal pressing. The spacing is designed to be smaller than the standard pitch, which compensates for the thermal expansion that will occur during binding. This preliminary adjustment ensures that after thermal expansion during the binding process, the terminals from substrates with different thermal expansion coefficients align properly, resolving the misalignment issue while maintaining reliable binding.
Solution Approach 2:
The patent changes the geometric parameter of the binding terminal spacing on the bearing substrate. Specifically, the spacing between adjacent binding terminals is set to a non-standard value that is smaller than the nominal pitch. This parameter change compensates for differential thermal expansion during the binding process, allowing terminals from substrates with different thermal expansion coefficients to align correctly after heating, thus improving both alignment precision and binding reliability.
2Manufacturing precision
If the distance between binding terminals is reduced to improve alignment, then terminal alignment improves, but the processing precision requirements increase
Solution Approach 1:
The patent applies preliminary anti-action by pre-compressing the spacing between binding terminals on the bearing substrate. The spacing is intentionally made smaller than the final required pitch to compensate for the thermal expansion that will occur during binding. This preliminary compression counteracts the harmful effect of thermal expansion, allowing the use of standard processing precision while achieving good alignment after binding, thus avoiding the need for higher processing precision.
3Ease of manufacture
If standard pitch spacing is used between binding terminals, then manufacturing is easier, but misalignment occurs during thermal pressing
Solution Approach 1:
The patent changes the spacing parameter between binding terminals on the bearing substrate from the standard pitch to a compressed value. This parameter change is specifically designed to compensate for differential thermal expansion during the binding process. By using this modified spacing, the patent maintains ease of manufacture with standard processing while achieving proper alignment after thermal pressing, thus resolving the contradiction between manufacturing ease and binding alignment reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the binding effect by increasing the overlapping area of the terminals, improving signal transmission and reducing misalignment issues, even with lower precision processing devices.
Implementation Method 1
A thermal expansion coefficient of the bearing substrate is greater than a thermal expansion coefficient of the integrated substrate... aligning and heating to align with second binding terminals
Data Source
AI summary
The present disclosure relates to the technical field of display, and provides a bearing substrate, a binding assembly, and a binding method thereof. The bearing substrate may be bound to an integrated substrate. A thermal expansion coefficient of the bearing substrate is greater than a thermal expansion coefficient of the integrated substrate. The integrated substrate includes a plurality of second binding terminals distributed at equal intervals in a same direction. The bearing substrate includes a plurality of first binding terminal sets distributed at equal intervals in a first direction, and each of the first binding terminal sets includes a plurality of first binding terminals distributed at equal intervals in the first direction for binding with the plurality of the second binding terminals one-to-one.