Substrate-less Electronic Part Package with Bellows Resin
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Solution Overview
Problem
Existing electronic part packaging technologies face challenges in achieving reliable connections and efficient heat dissipation, particularly in high-density mounting, due to issues like solder flash and inadequate heat radiation performance, which also raise concerns about cost and substrate usage.
Innovation Solution
The implementation of an electronic part package with a sealing resin layer featuring an irregular surface and a metal plating pattern layer that includes a laminated structure of dry-plated and wet-plated layers, directly joined to the electrode, providing enhanced connection reliability and heat dissipation characteristics without the need for soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used for mounting electronic parts, then connection reliability is improved, but solder flash occurs and heat dissipation performance deteriorates
Solution Approach 1:
The invention extracts and eliminates the soldering process from the mounting technology. Instead of using solder to connect electronic parts to substrates, the patent uses a substrate-less package where metal plating patterns directly contact the electrode, removing the source of solder flash while maintaining connection reliability through direct metal-to-metal contact.
Solution Approach 2:
The invention replaces the thermal-mechanical soldering process with a direct mechanical contact system. The metal plating pattern layer is formed to directly contact the electrode surface, substituting the solder joint with a direct metal contact that eliminates harmful solder flash while providing reliable electrical and mechanical connection.
2Reliability
If substrate is used for mounting electronic parts, then connection reliability is improved, but packaging cost increases and heat dissipation performance deteriorates
Solution Approach 1:
The invention extracts and removes the substrate from the package structure. By using a substrate-less package with a sealing resin layer and direct metal plating contact, it eliminates substrate-related costs while maintaining connection reliability through the direct electrode-to-metal plating contact mechanism.
Solution Approach 2:
The invention applies local quality by providing metal plating patterns only in specific regions where connection is needed, rather than using a comprehensive substrate structure. The metal plating is selectively formed on the sealing resin layer to contact the electrode, reducing material usage and cost while maintaining localized connection reliability.
3Ease of manufacture
If flat sealing resin layer is used, then manufacturing is simplified, but heat dissipation performance and connection reliability deteriorate
Solution Approach 1:
The invention introduces surface curvature to the sealing resin layer by forming protrusions and recesses on its upper surface. This curved/irregular surface structure increases the contact area between the metal plating pattern layer and the electrode, enhancing heat dissipation performance and connection reliability while the base flat structure maintains manufacturing simplicity.
Solution Approach 2:
The invention applies local quality by creating localized protrusions and recesses only in specific regions of the sealing resin layer where heat dissipation and connection are critical. The majority of the sealing resin layer remains flat for easy manufacturing, while localized surface variations provide enhanced thermal and electrical contact where needed.
4Productivity
If high-density mounting is implemented, then productivity is improved, but connection reliability and heat dissipation performance deteriorate
Solution Approach 1:
The invention transitions from planar contact to three-dimensional contact by forming protrusions and recesses on the sealing resin layer surface. This dimensional change allows the metal plating pattern layer to wrap around and contact the electrode more extensively, maintaining reliable connection and heat dissipation even in high-density mounting configurations where space is constrained.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves connection reliability and heat dissipation, reduces packaging costs, and allows for smaller, more flexible packages without the use of substrates, thereby addressing the limitations of existing technologies.
Implementation Method 1
a metal plating pattern layer that has a laminated structure including a dry-plated layer and a wet-plated layer
Implementation Method 2
a metal plating pattern layer that has a laminated structure including a dry-plated layer and a wet-plated layer
Implementation Method 3
The sealing resin layer includes a principal surface including a first region that has a bellows-like shape having alternate ridges and valleys
Data Source
AI summary
An electronic part package comprises a sealing resin layer, an electronic part and a metal plating pattern layer. The sealing resin layer is provided with a principal surface including a first region that has a bellows-like shape having alternate ridges and valleys and a second region that is flat. The electronic part includes an electrode having a principal surface and is covered by the sealing resin layer except the principal surface, which is surrounded by the second region. The metal plating pattern layer is integrally provided on the first and second regions and on the principal surface of the electrode. A portion of the metal plating pattern layer, the portion located on the first region, has a bellows-like shape having alternate ridges and valleys along an outline of the first region.