Bellows Sintering Chamber for Precise Pressure Range Control
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Solution Overview
Problem
Existing sintering devices with rigid or flexible structure chambers face limitations, such as high component count and cost, and are unsuitable for a wide pressure range, particularly in semiconductor chip packaging where precise control over small pressure ranges is necessary.
Innovation Solution
A pressure sintering mechanism with a controllable atmosphere using a telescopic tube with an elastically telescopic bellows section, two pressure components, and a heating component, allowing for flexible sealing and pressure application within a telescopic tube to form a sealed sintering chamber, enabling operation across various pressure ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid structure sintering chamber is used, then the chamber can maintain structural strength, but two sets of driving devices are required resulting in high component count and high costs
Solution Approach 1:
The patent combines the chamber closing function and the pressure application function into a single integrated pressure head assembly. The pressure head serves dual purposes: it closes the sintering chamber by engaging with the telescopic tube while simultaneously applying pressure to the product through the bellows mechanism. This eliminates the need for separate driving devices for chamber closing and pressure application, reducing component count while maintaining structural integrity.
2Device complexity
If a flexible structure sintering chamber is used, then the structure can be simplified, but the device is limited to large pressure ranges (greater than 1 ton) and is unsuitable for small pressure ranges (less than 100 kg)
Solution Approach 1:
The patent employs a dynamic bellows mechanism that can adapt its stiffness and pressure transmission characteristics based on the applied load. The bellows structure allows for controlled deformation under small pressures while maintaining structural integrity under large pressures. This dynamic behavior enables the same flexible chamber structure to operate effectively across both small pressure ranges (less than 100 kg) and large pressure ranges (greater than 1 ton), achieving multi-range adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the number of components, lowers costs, and allows for precise control over small pressure ranges, enhancing the sintering process in semiconductor chip packaging by forming a flexible sealed sintering chamber with reduced pressure on the telescopic tube, thus ensuring effective bonding.
Implementation Method 1
at least a part of the telescopic tube is an elastically telescopic bellows section
Implementation Method 2
a heating component configured to heat the product inside the sintering chamber
Implementation Method 3
the two pressure components are configured to seal an opening of an end of the telescopic tube when the two pressure components are close to each other to form a sealed sintering chamber inside the telescopic tube and apply pressure to a product inside the sintering chamber
Data Source
AI summary
Embodiments of the present disclosure provide a sintering device and a pressure sintering mechanism with a controllable atmosphere thereof. The pressure sintering mechanism with the controllable atmosphere includes: a telescopic tube, wherein at least a part of the telescopic tube is an elastically telescopic bellows section; two pressure components arranged opposite to each other, wherein the telescopic tube is configured between the two pressure components, the two pressure components are configured to seal an opening of an end of the telescopic tube when the two pressure components are close to each other to form a sealed sintering chamber inside the telescopic tube and apply pressure to a product inside the sintering chamber; and a heating component configured to heat the product inside the sintering chamber.