Below-PCB Chassis Coolant Manifold for Hot-Aisle-Free Service
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Solution Overview
Problem
Current liquid cooling systems in data centers face challenges such as safety concerns due to the need for operators to access hot aisles for servicing, complex and space-consuming manifold designs, and increased servicing costs and damage from leaks.
Innovation Solution
An integrated chassis coolant manifold located beneath the PCB and an integrated rack coolant manifold with front-side shut-off valves, allowing safe servicing without accessing hot aisles and optimizing space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If liquid cooling systems are implemented for high-heat server applications, then cooling efficiency is improved, but safety concerns arise due to the need for operators to access hot aisles for servicing
Solution Approach 1:
The patent repositions the coolant manifold from the traditional location above the PCB to a new dimension below the PCB. This spatial reconfiguration allows the coolant inlet and outlet to be accessible from the front of the rack rather than requiring access to the hot aisle at the back, thereby maintaining cooling efficiency while eliminating safety hazards associated with hot aisle access.
2Reliability
If traditional manifold designs are used, then cooling function is provided, but device complexity and space consumption increase
Solution Approach 1:
The patent integrates the coolant manifold directly into the chassis structure, merging two previously separate components (manifold and chassis) into a unified assembly. This integration simplifies the overall system design, reduces the number of separate parts, and decreases space consumption while maintaining the essential cooling function.
Solution Approach 2:
By relocating the manifold to below the PCB, the patent creates a more compact and efficient spatial arrangement. This dimensional change optimizes the use of available space within the chassis and reduces the complexity of routing coolant channels, thereby simplifying the overall manifold design while preserving cooling effectiveness.
3Ease of manufacture
If coolant manifold is located above the PCB, then cooling delivery is simplified, but space utilization is reduced and servicing complexity increases
Solution Approach 1:
The patent relocates the coolant manifold from above the PCB to below the PCB, utilizing the unused space in the lower dimension. This repositioning frees up the area above the PCB for additional server components, thereby improving space utilization while maintaining straightforward coolant delivery through the integrated manifold design.
4Ease of repair
If operators must access hot aisles for servicing, then cooling system maintenance is possible, but servicing costs and downtime increase
Solution Approach 1:
By repositioning the coolant manifold and its service access points to the front of the rack (below the PCB level), the patent enables technicians to perform maintenance, repairs, and inspections without entering the hot aisle. This dimensional reconfiguration allows servicing to be conducted from the cool aisle, significantly reducing servicing downtime and eliminating the need for operators to expose themselves to high temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances safety by eliminating the need for hot aisle access, reduces servicing complexity and costs, and minimizes damage from leaks by containing coolant below the PCB, thus improving operational efficiency and reducing downtime.
Implementation Method 1
liquid cooling systems remove heat more efficiently than air-based cooling systems
Implementation Method 2
liquid cooling loops... circulate a liquid coolant
Data Source
AI summary
A disclosed server liquid cooling system includes a chassis coolant manifold housed in a base portion of a chassis below a PCB of the chassis. The chassis coolant manifold is adapted to cool server hardware on the PCB by circulating a liquid coolant throughout channels below the PCB between a coolant inlet and a coolant outlet.