Bi-directional Bend Sensor with Segmented Finger Circuits

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional bend sensors are limited to unidirectional detection of bending amplitudes due to resistance variation through deformation of resistor sections, restricting their ability to detect deformations in specific patterns.

Innovation Solution

A bend sensor design featuring a flexible circuit substrate with alternating first and second circuits and an insulation pad creates a central hollow space for varying contact with a conductive layer, allowing bi-directional bending detection by altering the equivalent resistance based on bending deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the bend sensor uses resistance variation through deformation of resistor sections to detect bending, then the bending amplitude can be detected, but the detection is strictly limited to specific bending patterns and unidirectional

Engineering Contradiction:
Improvebending detection accuracyVSAvoiddetection direction range
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The conductive circuit is segmented into multiple conductive sections and resistor sections arranged alternately. This segmentation allows different sections to respond to bending from different directions, enabling multi-directional detection capability while maintaining detection accuracy through the combined response of all segments.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The bend sensor is designed to detect bending amplitudes from multiple directions by incorporating conductive sections that can respond to various bending patterns. The sensor structure allows it to function as a universal bending detector rather than being limited to a single detection direction, achieving multi-functionality in terms of detection orientation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If the resistance-varying layer is formed by alternately arranging conductive sections and resistor sections, then the resistance varies significantly with bending deformation, but the device complexity increases

Engineering Contradiction:
Improveresistance variation sensitivityVSAvoidcircuit structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The conductive circuit and resistance-varying layer are merged into a single integrated structure where conductive sections and resistor sections are alternately arranged. This merging allows the sensor to achieve significant resistance variation with bending while simplifying the overall device structure by combining multiple functions into one component.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective bi-directional bending detection and increased sensitivity by varying the total resistance between circuits with changing contact numbers of fingers and the conductive layer, providing a wider detection range compared to conventional sensors.

Implementation Method 1

a total contact number of the plurality of first fingers and the plurality of second fingers with the conductive layer would be varied according to a change in the bending deformation of the bend sensor, such that an equivalent resistance between the first circuit and the second circuit would vary accordingly

Methodology Applied
Scientific EffectContact resistance variation: Electrical Resistance

Data Source

PatentUS10302459B2Bend sensor
Publication Date: 2019.05.28 TAIWAN ALPHA ELECTRONICS
  • US10302459B2 patent drawing
  • US10302459B2 patent drawing
  • US10302459B2 patent drawing

AI summary

A bend sensor includes a flexible circuit substrate, an insulation pad and a flexible conductive substrate. The flexible circuit substrate includes an insulating body, a first circuit and a second circuit. The first and second circuits are disposed on opposing sides of the insulating body. The first circuit has first fingers, while the second circuit has second fingers. The insulation pad disposed on the insulating body exposes the first and second fingers. The flexible conductive substrate disposed on the insulating pad has a conductive layer separated from the first fingers and the second fingers. While the bend sensor is bent, the conductive layer on the flexible conductive substrate would deform toward the flexible circuit substrate so as to form multiple contacts with the first and second fingers. Through these contacts, a number of resistors are formed to contribute a detectable resistance for the corresponding bending amplitude to be further realized.