Bendable Device Structure for Slim Frames and ESD Grounding

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Solution Overview

Problem

Existing display devices face issues with oversized side frames affecting appearance and potential electrostatic discharge failures due to ungrounded external electrostatic charge.

Innovation Solution

A bendable device design incorporating a frame, light shielding layer, flexible substrate with transistors, and a flexible film with a conductive layer, connected by an adhesive material, which includes a conductive structure for grounding external static electricity and minimizing frame visibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If side frames are disposed to encase interior display panels, then protection is achieved, but appearance is degraded due to oversized frames

Engineering Contradiction:
ImproveprotectionVSAvoidappearance
Core Design Contradiction:
StrengthVSShape

Solution Approach 1:

The patent extracts the protective function from the traditional side frame structure and relocates it to the bendable device edges. The flexible substrate with conductive layers provides protection without requiring visible external frames, thus maintaining aesthetic appearance while achieving encasement protection.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs flexible substrates and thin conductive films to provide protection. These thin, flexible structures replace bulky side frames, offering the necessary protective function while being visually unobtrusive and maintaining device aesthetics.

Inventive Principle:
Principle #30Flexible shells and thin films

2Strength

If traditional frame structure is used, then protection is provided, but electrostatic discharge failure occurs due to ungrounded external electrostatic charge

Engineering Contradiction:
ImproveprotectionVSAvoidelectrostatic discharge protection
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent introduces a conductive layer as an intermediary between the flexible substrate and the external environment. This conductive layer acts as a mediator that captures external electrostatic charges and directs them to ground, preventing ESD damage to internal components while maintaining the protective function.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The flexible substrate structure integrates the grounding function directly into its construction. The conductive layers within the flexible substrate automatically discharge electrostatic charges without requiring external intervention or additional protective components, making the system self-protecting against ESD.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances aesthetic appeal by reducing frame visibility and effectively reduces the probability of electrostatic damage through efficient grounding, improving display device reliability.

Implementation Method 1

The flexible film is connected to the flexible substrate and includes a conductive layer. The first adhesive material connects at least a portion of the flexible film and at least a portion of the flexible substrate.

Methodology Applied
Scientific EffectElectrostatic discharge grounding: Electrostatic Discharge

Data Source

PatentUS12379621B2Bendable device
Publication Date: 2025.08.05 INNOLUX CORP
  • US12379621B2 patent drawing
  • US12379621B2 patent drawing
  • US12379621B2 patent drawing

AI summary

A bendable device is provided. The bendable device includes: a frame, a light shielding layer, a flexible substrate, a flexible film, and a first adhesive material. The light shielding layer is disposed on the frame. The flexible substrate is disposed on the frame and includes a plurality of transistors. The flexible film is connected to the flexible substrate and includes a conductive layer. The first adhesive material connects at least a portion of the flexible film and at least a portion of the flexible substrate.