Bendable Display Wiring Protection Against Tensile-Stress Cracks

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Solution Overview

Problem

Bendable display devices face challenges in maintaining structural integrity and preventing damage to conductive layers during the bending process, particularly due to tensile stress, which can lead to cracks and disconnections in the inorganic insulating layers and conductive layers.

Innovation Solution

The implementation of an inorganic protective layer covering at least a portion of the conductive layer, combined with a design that includes an organic layer overlapping the bending area and specific wiring configurations, helps to prevent cracks and disconnections by distributing stress and enhancing the durability of the display device during bending.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the display device is made bendable to achieve flexible shapes, then adaptability and versatility are improved, but the structural integrity and reliability deteriorate due to tensile stress causing cracks and disconnections in conductive and insulating layers

Engineering Contradiction:
ImprovebendabilityVSAvoidstructural integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The device is divided into a bending area and non-bending areas, with the bending area specifically designed to accommodate flexing while the non-bending areas maintain structural rigidity. This segmentation allows the device to be bendable without compromising the integrity of critical components.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the display device have different structural properties: the bending area has a configuration optimized for flexibility, while the non-bending areas have enhanced structural support. The inorganic protective layer is selectively positioned to provide reinforcement where tensile stress is most likely to cause damage.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If the display device structure is simplified to reduce manufacturing complexity, then ease of manufacture is improved, but the ability to prevent cracks and disconnections during bending deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidcrack prevention
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The display device employs a composite structure combining organic and inorganic layers. The inorganic protective layer provides crack prevention and structural reinforcement, while the organic layers maintain flexibility. This composite approach enhances reliability without significantly complicating the manufacturing process.

Inventive Principle:
Principle #40Composite materials

3Reliability

If the inorganic protective layer is extended to cover the entire conductive layer, then reliability is improved by preventing cracks, but device complexity increases due to additional manufacturing steps

Engineering Contradiction:
Improveconductive layer protectionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The inorganic protective layer is positioned to cover specific critical areas of the conductive layer where tensile stress during bending is most likely to cause cracks and disconnections, rather than providing uniform coverage across the entire conductive layer. This targeted approach enhances reliability while minimizing additional manufacturing complexity.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11805688B2Bendable display device
Publication Date: 2023.10.31 SAMSUNG DISPLAY CO LTD
  • US11805688B2 patent drawing
  • US11805688B2 patent drawing
  • US11805688B2 patent drawing

AI summary

A display device includes a substrate having a first area, a second area, and a bending area disposed between the first area and the second area. An inner wiring is disposed in the first area. An outer wiring is disposed in the second area. An interlayer insulating layer covers the inner wiring and the outer wiring, and includes a first contact hole. A conductive layer is disposed on the interlayer insulating layer, and is connected to the inner wiring or the outer wiring through the first contact hole. An inorganic protective layer covers at least a portion of the conductive layer and includes an inorganic insulating material.