Bendable Display Panel Micro-chip Segmentation
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Solution Overview
Problem
The disposition of integrated circuits (ICs) in flexible or bendable display panels affects the flexibility and bendability of the panels, as they are typically placed in peripheral non-display areas, limiting the panels' ability to bend without compromising performance.
Innovation Solution
A display module with a driving module in the peripheral area, comprising a first micro-chip and multiple second micro-chips, along with a transistor-based shift register and demultiplexer circuit, optimized for size and placement to enhance flexibility and bendability by determining the width and distance of the micro-chips, allowing for improved flexibility and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If integrated circuits are disposed in the peripheral non-display area, then the display panel can maintain its display functionality, but the flexibility and bendability of the display panel are compromised
Solution Approach 1:
The integrated circuit is divided into multiple micro-chips (first micro-chip and second micro-chips) that are disposed in a straight line in the peripheral area. This segmentation reduces the area occupied by each individual chip and distributes them along a line, thereby improving the bendability of the display panel while maintaining display functionality.
Solution Approach 2:
The micro-chips are strategically positioned in the peripheral non-display area rather than uniformly distributed or placed in the display area. This local placement optimizes both the flexibility of the panel and the functional requirements of the display system.
2Adaptability or versatility
If the width of micro-chips and distance between them are reduced to improve bendability, then flexibility increases, but the driving capability may be insufficient
Solution Approach 1:
The driving function is segmented across multiple micro-chips (first micro-chip and second micro-chips) arranged in a straight line. This segmentation allows each chip to have reduced width for improved bendability, while the collective arrangement maintains sufficient driving capability through distributed functionality.
Solution Approach 2:
Instead of increasing chip width in a two-dimensional plane to improve driving capability, the solution transitions to a one-dimensional linear arrangement of multiple smaller chips. This dimensional change allows the system to achieve adequate driving power through the series arrangement while maintaining small individual chip sizes for flexibility.
Data Source
AI summary
A display module includes a flexible and bendable display panel defining a display area and a peripheral area thereon, and a driving module disposed in the peripheral area. The driving module includes a first micro-chip, multiple second micro-chips, a transistor-based shift register circuit and a transistor-based demultiplexer (de-MUX) circuit. The first micro-chip provides the functions of image receiver, level shift and gamma buffer. Each of the second micro-chips provides the functions of latch, digital to analog converter and output buffer. The transistor-based shift register circuit generates shift register output signals for the second micro-chips. The transistor-based de-MUX receives the analog data signals from the second micro-chips and send the analog data signals to a plurality of data lines.