Bendable Display Panel Support Layer With Localized Modulus Control
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Solution Overview
Problem
Display devices with bendable panel layers face increased defect rates due to improper formation of the support layer, leading to cracks when the panel is bent.
Innovation Solution
A display device design with a support layer having a storage modulus of 0.01 Mpa to 0.1 Mpa in the bendable area and an encapsulation layer thickness of 1 to 8.8 μm, utilizing organic materials like silicon-based resin and heat dissipation materials to enhance flexibility and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the support layer is made rigid to provide structural support, then the strength and stability are improved, but cracks occur when the panel layer is bent
Solution Approach 1:
The patent applies parameter changes by precisely controlling the storage modulus of the support layer within the range of 0.01 MPa to 0.1 MPa in the bending area. This parameter optimization allows the support layer to maintain sufficient strength while achieving the flexibility needed to prevent cracks during bending, thereby resolving the contradiction between strength and reliability
Solution Approach 2:
The patent implements local quality by creating different mechanical properties in different areas of the support layer. The support layer has a storage modulus of 0.01 MPa to 0.1 MPa specifically in the bending area (second area), while other areas may have different properties. This localized property adjustment enables the support layer to flex without cracking in the bending region while maintaining overall structural integrity
2Strength
If the encapsulation layer thickness is increased to improve protection, then the strength is improved, but the flexibility and strain rate decrease
Solution Approach 1:
The patent applies parameter changes by optimizing the encapsulation layer thickness to within 1 μm to 8.8 μm in the bending area. This precise thickness control maintains adequate protective strength while preserving the flexibility and strain rate (>1.5%) needed for bending applications, resolving the contradiction between strength and adaptability
Solution Approach 2:
The patent implements local quality by varying the encapsulation layer thickness based on location. The thickness is controlled to be 1 μm to 8.8 μm specifically in the bending area (second area), while other areas may have different thicknesses. This localized thickness adjustment provides sufficient protection in non-bending areas while maintaining flexibility in bending areas
Data Source
AI summary
A display device includes a panel layer including a first area and a second area. A support layer is disposed on a first surface of the panel layer. At least a portion of the panel layer is bendable in the second area. The support layer overlaps with the second area in a plan view. The support layer has a storage modulus in a range of about 0.01 Mpa to about 0.1 Mpa in an area that the support layer overlaps with the second area in the plan view.