Bendable Memory Module Equalizing Signal Lines
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Solution Overview
Problem
Conventional memory systems face challenges in equalizing signal line lengths between memory controllers and modules, leading to impedance mismatching and transmission delays due to the inflexible nature of circuit boards, limiting the routing options and causing signal distortion.
Innovation Solution
A memory module comprising flexible couplers, such as film cables or electrical wires, connecting circuit boards that can be bent to equalize and minimize signal line lengths between memory chips and the memory controller, allowing direct data transmission via module taps on each board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If signal lines are bent to equalize routing distances on the circuit board, then signal transmission distance is equalized, but impedance mismatching and transmission delay occur
Solution Approach 1:
The invention divides the memory module into multiple independent circuit boards (first circuit board, second circuit board, etc.), each with its own memory chips and module taps. This segmentation allows each board to be independently routed to the memory controller, eliminating the need to bend signal lines on a single board and thus avoiding impedance mismatching while achieving equalized signal transmission distances.
Solution Approach 2:
The invention transitions from a two-dimensional layout on a single circuit board to a three-dimensional configuration with multiple circuit boards stacked or arranged in space. This dimensional change provides additional routing flexibility, allowing signal lines to be routed directly from each circuit board to the memory controller without bending, thereby maintaining signal integrity while equalizing transmission distances.
2Area of stationary object
If circuit board layout is constrained by limited real estate, then routing flexibility is reduced, but signal line length equalization becomes more difficult
Solution Approach 1:
By segmenting the memory module into multiple smaller circuit boards, the invention overcomes the limited real estate on a single large board. Each smaller board can be optimally routed to the memory controller, achieving signal line length equalization without being constrained by the layout limitations of a single large board.
3Manufacturing precision
If multiple bends are introduced in signal lines to equalize routing, then routing distance is equalized, but signal distortion increases
Solution Approach 1:
The segmentation of the memory module into multiple circuit boards eliminates the need for multiple bends in signal lines. Each circuit board can be positioned and routed directly to the memory controller with minimal or no bends, thereby achieving routing distance equalization without introducing signal distortion that would result from multiple bends.
Data Source
AI summary
A memory module and a memory system are provided. The memory module includes a first circuit board on which at least one memory chip is mounted, a second circuit board on which at least one memory chip is mounted, and a flexible coupler electrically connecting the first circuit board to the second circuit board. The memory module is bendable and is configured to extend around a memory controller. The memory chips are electrically coupled with the memory controller via a respective plurality of signal lines. The bendable memory module is configured to be bent around the memory controller such that respective lengths of the signal lines are equal.