Bendable Monolithic PCB for LED Thermal Management
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Solution Overview
Problem
Existing light generating devices, such as LED spotlights, often require complex assembly processes due to multiple components and separate heat spreaders, which complicates the manufacturing and assembly processes.
Innovation Solution
A light generating device design featuring a solid state light source supported by a monolithic support with at least two bent support parts, where one part thermally contacts the housing wall, eliminating the need for a separate heat spreader and simplifying assembly by integrating all electronic components on a single support, such as a metal-core printed circuit board (MCPCB).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional LED spotlight design with separate heat spreader and multiple components is used, then thermal management can be achieved, but the assembly process becomes complicated and manufacturing complexity increases
Solution Approach 1:
The patent combines the heat spreader and the PCB support structure into a single integrated component. The PCB is directly mounted on the heat spreader, eliminating the need for separate mounting operations and reducing assembly steps. This merging of functions directly addresses the contradiction by maintaining thermal management capabilities while simplifying the assembly process.
Solution Approach 2:
The heat spreader is designed to serve multiple functions simultaneously: it acts as both the thermal management component and the structural support for the PCB and LED module. This multi-functionality reduces the total number of components needed and simplifies manufacturing while ensuring effective heat dissipation from the LED to the heat spreader.
2Reliability
If multiple separate components are used in the LED spotlight, then each component can be optimized independently, but the number of components increases and assembly time increases
Solution Approach 1:
By integrating the heat spreader and PCB support into one component, the patent reduces the number of parts that need to be individually assembled. The LED module can be mounted directly onto the integrated structure, significantly reducing assembly time while maintaining the ability to optimize each functional aspect during the design phase.
3Device complexity
If a monolithic support structure with bent parts is used, then the number of components is reduced and assembly is simplified, but manufacturing precision requirements increase
Solution Approach 1:
The PCB support structure is pre-bent during manufacturing to the required angles and configurations. This preliminary action ensures that when the component is assembled, the LED module and housing are already in the correct positions, reducing the need for complex alignment operations and actually lowering the overall assembly precision requirements despite the complex geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the number of components, facilitates easier assembly, and enhances thermal conductivity for effective heat dissipation, resulting in a low-cost, easy-to-manufacture configuration with improved thermal contact and performance.
Implementation Method 1
a first support part of the at least two support parts is configured to support the light source, and wherein a further support part of the at least two support parts is configured in thermal contact with the housing wall
Data Source
AI summary
The light generating device including at least one solid state light source, a monolithic support for the light source with first and second support parts bent relative to each other, and a housing having a housing wall. The light source is supported by the first support part, with the second support part in thermal contact with the housing wall. At least a portion of the support located between the light source and the housing wall is thermally conductive.