Bendable Organic Photodiode Array for CT Imaging
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Solution Overview
Problem
Existing CT imaging systems face high costs and complexity due to the precise mechanical and electrical connection requirements of x-ray detectors, which are challenging to achieve with conventional connectors and mounting methods.
Innovation Solution
The use of a bendable organic photodiode array with scintillators and active electronic components, where the organic photodiodes are printed on a flexible support and connected via conductors, allowing for precise alignment and reduced tolerance buildup, enabling a more cost-effective and efficient data measurement system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional connectors and mounting methods are used to connect x-ray detectors, then mechanical and electrical connection precision can be achieved, but the cost and complexity of the system increase substantially
Solution Approach 1:
The patent combines mechanical support and electrical connection functions into a single integrated printed circuit board structure. The flexible PCB serves both as the mechanical substrate that holds the photodiodes and scintillators in precise positions and as the electrical conductor that transfers signals, eliminating the need for separate connectors and mounting hardware.
Solution Approach 2:
The invention replaces traditional mechanical connector systems with a printed circuit board-based electrical connection system. Instead of using mechanical connectors to establish electrical contacts between detector arrays and the readout system, the patent uses flexible PCB traces that provide both structural support and electrical connectivity through a unified planar structure.
2Ease of manufacture
If traditional rigid detector arrays are used, then electrical connection is achieved, but mechanical flexibility and reduced tolerance buildup are lost
Solution Approach 1:
The patent employs a flexible printed circuit board made from thin film materials that can be bent and conform to curved surfaces. This flexible substrate maintains precise relative positioning of detector elements while allowing the entire array to be shaped into the required curved geometry for CT imaging, reducing the need for complex mechanical alignment and tolerance control.
Solution Approach 2:
The detector array is designed with flexible mechanical properties that allow it to be dynamically shaped and positioned during assembly and installation. The flexible PCB can be bent into the required curved configuration and maintains its shape through elastic recovery, enabling easier integration into the CT scanner geometry without requiring rigid mechanical fixtures.
3Measurement precision
If expensive precision connectors are used to mount detector arrays, then high spatial precision is achieved, but the overall system cost increases
Solution Approach 1:
The patent uses inexpensive printed circuit board materials and standard PCB fabrication processes instead of expensive precision-machined connectors. The flexible PCB can be manufactured using conventional printing and lamination techniques, significantly reducing the cost per detector array while maintaining sufficient spatial precision through the printed conductor trace geometry.
Solution Approach 2:
The invention changes the manufacturing parameters from precision mechanical machining to printed circuit board fabrication processes. By using PCB tracing and lamination techniques, the system achieves the required spatial precision through controlled printing parameters and material selection rather than expensive mechanical tolerances, reducing overall system cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the overall cost and complexity of the CT imaging system by allowing for precise alignment of detector pixels while minimizing the need for expensive connectors and mechanical precision, enabling high-quality imaging with a multi-layer spectral CT data measurement system.
Implementation Method 1
a bendable organic photodiode array with scintillators and active electronic components, where the organic photodiodes are printed on a flexible support
Implementation Method 2
one or more scintillators disposed above the organic photodiodes on the bendable support
Data Source
Figure 1
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Figure 4
AI summary
An imaging system includes a macro organic photodiode array with rows and columns of printed photodiodes. The array may be bendable for easy manufacture and assembly on a curved support within an imaging system. Two or more layers of photodiodes may be provided for use in a spectral CT imaging system or as slices.