Bendable Organic Layer Wiring for Display Reliability
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Solution Overview
Problem
The existing manufacturing processes for electronic devices with bendable regions are complex and costly due to the need for separate processes for forming organic layers and signal lines in the input sensing unit, leading to increased processing time and cost.
Innovation Solution
The electronic device design integrates a bendable region with a base substrate that includes a groove exposing the base substrate, allowing for the formation of organic layers and signal lines in a single process, reducing complexity and cost by using the same materials for the organic layers and insulating layers, and overlapping the connection wiring with the first organic layer in the bendable region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate processes are used for forming organic layers and signal lines in the input sensing unit, then the manufacturing precision and reliability are improved, but the device complexity and processing time increase
Solution Approach 1:
The patent merges the formation of organic layers and signal lines into a single integrated process. The connection wiring is formed in the same manufacturing step as the organic layers of the input sensing unit, eliminating the need for separate processes. This is achieved by designing the connection wiring to be formed on the organic layer using the same material deposition and patterning steps, thereby reducing device complexity while maintaining reliability.
Solution Approach 2:
The organic layer serves multiple functions: it acts as both the organic layer for the input sensing unit and as the insulating layer for the connection wiring. By using the same material and formation process for both purposes, the patent reduces the number of manufacturing steps while ensuring consistent quality and reliability across both components.
2Manufacturing precision
If separate processes are used for forming organic layers and signal lines, then the manufacturing precision is improved, but the processing time increases
Solution Approach 1:
The patent combines the formation of organic layers and signal lines into a single manufacturing process. The connection wiring is formed simultaneously with the organic layers through integrated deposition and patterning steps, eliminating redundant processing time while maintaining manufacturing precision through unified process control.
Solution Approach 2:
The patent performs preliminary design of the connection wiring layout to ensure it can be formed in the same process as the organic layers. By pre-planning the wiring path and integration points, the manufacturing process can proceed in a single pass without requiring additional time-consuming steps, thus reducing processing time while preserving precision.
3Strength
If rigid structures are used in the bendable region, then the structural strength is improved, but the flexibility and reliability under bending stress worsen
Solution Approach 1:
The patent replaces rigid structures with flexible organic layers in the bendable region. The connection wiring is formed on the organic layer, which can bend without cracking or deforming. This flexible organic layer structure maintains structural integrity during bending while ensuring reliable electrical connections, thereby improving bending reliability without sacrificing necessary strength.
Solution Approach 2:
The patent changes the material parameters of the connection wiring and surrounding layers to enhance flexibility. By selecting materials with appropriate mechanical properties for the bendable region and adjusting layer thicknesses, the structure achieves both sufficient strength and high flexibility, ensuring reliable operation under bending stress.
4Manufacturing precision
If complex manufacturing processes are used, then the manufacturing precision is improved, but the processing cost increases
Solution Approach 1:
The patent merges multiple manufacturing steps into a single integrated process for forming organic layers and connection wiring. By using the same deposition, patterning, and curing steps for both components, the patent eliminates redundant equipment usage and material handling, thereby reducing processing costs while maintaining high manufacturing precision through unified process control.
Solution Approach 2:
The organic layer material and formation process serve multiple functions: creating the organic layer for the input sensing unit and providing the insulating layer for the connection wiring. This multi-functionality reduces the number of distinct manufacturing steps and materials required, lowering overall manufacturing costs while preserving the precision needed for both components.
Data Source
AI summary
An electronic device includes an organic layer disposed in a bendable region and a connection wiring disposed on the organic layer. The connection wiring is connected to the signal lines connected to pixels of a display unit. The organic layer and the connection wiring in the bendable region include the same materials as those in an input sensing unit.