Bendable Display Panel and Digitizer Layout for Slim Foldables
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Solution Overview
Problem
Existing electronic devices face challenges in achieving a slim form factor while integrating a digitizer and display panel effectively, particularly in accommodating bending and folding mechanisms without compromising functionality.
Innovation Solution
The electronic device incorporates a digitizer directly beneath the display panel, with a layered structure including organic and inorganic materials, and employs electromagnetic resonance for input detection, along with a specific layering and fabrication process to ensure flexibility and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a digitizer and display panel are integrated in a conventional stacked configuration, then input detection and display capabilities are maintained, but the device thickness increases and flexibility is compromised
Solution Approach 1:
The patent merges the digitizer and display panel into a single integrated structure where the digitizer is positioned directly at the front surface of the display panel. This combination eliminates the need for separate stacked components, reducing overall device thickness while maintaining both display and input detection functionalities through shared structural elements and overlapping active regions.
2Adaptability or versatility
If a conventional rigid structure is used for the display panel and digitizer, then manufacturing and assembly are simplified, but the device cannot achieve folding or bending capabilities
Solution Approach 1:
The patent employs flexible thin film structures for both the display panel and digitizer components, enabling the device to be folded or bent. The digitizer and display panel are constructed with flexible substrates and thin-layered materials that maintain structural integrity and functional performance during folding, allowing the device to transition between flat and folded states without compromising manufacturing feasibility.
3Ease of manufacture
If the digitizer is positioned away from the display panel, then each component can be manufactured independently with standard processes, but the overall device becomes thicker and less integrated
Solution Approach 1:
The patent combines the digitizer and display panel into a tightly integrated structure where the digitizer is positioned directly at the front surface of the display panel. This merging eliminates gaps and intermediate spacing between components, reducing overall device thickness while maintaining compatibility with independent manufacturing processes for each component layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a slim, flexible electronic device that maintains effective input detection and display capabilities, even in folded states, enhancing user interaction and device portability.
Implementation Method 1
The digitizer of the electronic device may include various sensing coils to be activated with electrical signals. A region where the sensing coils are activated corresponds to external signals.
Data Source
AI summary
An electronic device includes a display panel including a base layer and a pixel, where the base layer includes a bending region which is bendable about an imaginary bending axis extending in a first direction, and a first non-bending region and a second-bending region which are spaced apart in a second direction from the bending region across the first non-bending region, and where the pixel is on the base layer to overlap the first non-bending region. The electronic device further includes a digitizer in contact with a lower portion of the base layer, a first driver chip connected to the pixel and on a portion of the base layer overlapping the second non-bending region, and a second driver chip connected to the digitizer and on a portion of the base layer overlapping the second non-bending region.


