Bendable Substrate for Angular Die Positioning in Catheters
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Solution Overview
Problem
Incorporating integrated devices into small form factor systems, such as catheter assemblies, is challenging due to the difficulty in providing electrical sensing and actuation in compact spaces without compromising flexibility and maneuverability.
Innovation Solution
A compact integrated device package with a bendable substrate that allows for the angular positioning of integrated device dies, processed signals within the catheter assembly, and reduced wire usage, utilizing a flexible insulating sheet with embedded conductors to facilitate signal transmission and mechanical coupling of dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If integrated device dies are incorporated into small form factor systems, then electrical sensing and actuation capabilities are improved, but the flexibility and maneuverability of the system deteriorates due to rigid wire bundles and compact spacing
Solution Approach 1:
The package substrate is divided into multiple segments (first segment, second segment, bendable segment) that can move relative to each other. The bendable segment acts as a flexible joint between rigid segments containing device dies, allowing the substrate to conform to curved pathways while maintaining electrical connectivity through flexible conductors embedded in the bendable segment.
Solution Approach 2:
The bendable segment of the package substrate incorporates flexible conductors and a flexible insulating material structure that allows bending and angular positioning. This flexible portion enables the substrate to navigate non-linear pathways within catheter assemblies without compromising the rigidity of device die mounting segments.
2Adaptability or versatility
If multiple integrated device dies are mounted on a rigid substrate, then device functionality is improved, but the device package size increases beyond small form factor constraints
Solution Approach 1:
The package substrate transitions from a completely rigid structure to a dynamic structure with a bendable segment that can change angle between 0 and 180 degrees. This dynamic configuration allows the substrate to compact into smaller spaces when bent, while maintaining full functionality when deployed in its operational configuration within the catheter assembly.
Solution Approach 2:
The bendable segment allows the substrate to fold or nest upon itself, enabling multiple device dies to be positioned in a compact arrangement that fits within small form factor constraints while maintaining their functional spacing when the bendable segment is deployed.
3Reliability
If wire bundles are used to connect device dies, then electrical connectivity is achieved, but the stiffness of the system increases and maneuverability decreases
Solution Approach 1:
Traditional rigid wire bundles are replaced with flexible conductors embedded within the flexible insulating material of the bendable segment. This substitution maintains reliable electrical connectivity while eliminating the stiffness associated with traditional wire bundles, allowing the substrate to bend and flex as needed.
Solution Approach 2:
The bendable segment uses a composite structure combining flexible conductors with flexible insulating material, creating a unified flexible connection system that provides both electrical connectivity and mechanical flexibility, eliminating the need for separate rigid wire bundles.
Data Source
AI summary
Compact integrated device packages are disclosed. The package comprises a package substrate, a first integrated device die, and a second integrated device die. The first die and the second die are mounted and electrically connected to a first segment and a second segment of the package substrate respectively. The substrate comprises a bendable segment disposed between the first and second segment and can bend so as to angle the first die relative to the second die.