Bendable Touch Panel Insulating Layer Stress Relief

The patent applies composite materials by combining inorganic material layers (such as silicon nitride or silicon oxide) with organic material layers (such as acrylic resin or epoxy resin) to form a multi-layer insulating structure. This composite approach allows the inorganic layer to provide insulation while the organic layer provides flexibility and bending resistance, resolving the contradiction between insulation performance and bending resistance.

The patent implements local quality by creating openings in the inorganic material layer at specific locations corresponding to electrode wire intersections and filling these openings with organic material. This localized modification allows the inorganic layer to maintain insulation performance in most areas while the organic-filled openings provide stress relief and bending resistance at critical points.

The patent applies segmentation by introducing openings in the inorganic material layer at electrode wire intersections. This divides the continuous inorganic layer into segmented regions, allowing stress to be distributed and relieved at the opening locations during bending, thereby reducing tensile stress on the electrode wires while maintaining protection in the remaining inorganic layer areas.

The patent uses the organic material layer as an intermediary substance that fills the openings in the inorganic layer. This intermediary organic material absorbs and distributes tensile stress during bending, preventing stress concentration at the electrode wire intersections and reducing the likelihood of wire breakage while the inorganic layer maintains its protective function.