Bendable-Wire Windings for Lower-Cost Rotor Position Sensors
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Solution Overview
Problem
Conventional position sensor devices and systems are costly due to the use of printed circuit boards, which contribute significantly to the manufacturing expenses.
Innovation Solution
The proposed solution involves replacing costly printed circuit boards with inexpensive printed circuit boards or using wire windings formed from bendable conductor wires, which are partially or entirely outside the printed circuit board, to reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional printed circuit boards are used for sensor devices, then manufacturing precision and reliability are maintained, but manufacturing cost increases significantly
Solution Approach 1:
The patent replaces expensive conventional printed circuit boards with inexpensive flexible circuits that can be manufactured using simpler, more cost-effective processes. The flexible circuits achieve the necessary electrical connections without requiring the complex multi-layer PCB structure, thereby reducing manufacturing costs while maintaining functional reliability
Solution Approach 2:
The patent changes the physical form and material parameters of the circuit substrate from rigid PCB to flexible circuit material. This parameter change enables the use of alternative, more cost-effective manufacturing methods such as flexible PCB or rigid-flex PCB processes, which can reduce material costs and manufacturing complexity while maintaining electrical performance
2Ease of manufacture
If conventional printed circuit boards are used for sensor devices, then electrical connectivity is reliable, but device complexity and cost increase
Solution Approach 1:
The patent employs flexible circuit materials that can be bent and conform to different shapes, replacing the rigid multi-layer PCB structure. This flexibility allows for simpler device integration and reduces the overall structural complexity of the sensor device while maintaining reliable electrical connections between components
Solution Approach 2:
The patent utilizes rigid-flex PCB technology that combines rigid and flexible portions in a three-dimensional structure. This allows the circuit to fold and connect components in space more efficiently, reducing the planar footprint and simplifying the overall device architecture compared to traditional flat PCB layouts
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of sensor devices and systems at lower costs while maintaining functionality, as the use of bendable conductor wires as windings provides a cost-effective alternative to traditional printed circuit boards.
Implementation Method 1
a primary winding (4a) and at least one secondary winding (4b) which are at least partially formed by a conductor wire
Implementation Method 2
The invention provides a sensor device for a position sensor... with a primary winding (4a) and at least one secondary winding (4b) which are at least partially formed by a conductor wire
Data Source
AI summary
A sensor device for a position sensor, preferably a rotor position sensor, with a printed circuit board is provided. The sensor device includes a primary winding and at least one secondary winding, and a device body. At least one of the primary winding and the at least one secondary winding is formed at least partially by a bendable conductor wire. One of the bendable conductor wire of the primary winding and the at least one secondary winding is mounted completely on a surface portion of the device body.