Bendable Wiring Mold for Side-Face Printing in Bezel-Less Displays
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Solution Overview
Problem
Existing display device manufacturing processes face challenges in efficiently forming bezel-less designs with side-face wiring, which limits the maximization of display area.
Innovation Solution
A mold for printing wiring is developed, featuring a first and second lever part, a bendable part, and protruding portions with hinge grooves, allowing for the transfer of conductive ink onto a substrate's side face and facilitating the formation of side-face wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional printing methods are used for wiring formation, then the manufacturing process is simple, but the display area cannot be maximized due to the presence of bezel area
Solution Approach 1:
The mold is divided into multiple independent parts including first and second lever parts, a bendable part, and multiple protruding portions with hinge grooves. This segmentation allows each part to perform specific functions independently, enabling the complex wiring formation process to be achieved through coordinated movement of modular components rather than a monolithic complex structure
Solution Approach 2:
The invention transitions from conventional planar wiring formation to three-dimensional side-face wiring formation. The mold structure enables conductive ink to be deposited not only on the front surface but also on the side faces of the substrate, utilizing the vertical dimension to create bezel-less display designs with maximized display area
2Area of stationary object
If side-face wiring formation is implemented to maximize display area, then the display area is maximized, but the processability and manufacturing complexity increase
Solution Approach 1:
The mold incorporates dynamic elements including the bendable part that can flex and the lever parts that can rotate or move. The hinge grooves enable controlled bending movements, allowing the mold to adapt its shape during the printing process to access side faces of the substrate. This dynamic capability simplifies the manufacturing process compared to requiring multiple static molds or complex positioning mechanisms
Solution Approach 2:
The bendable part acts as an intermediary element between the rigid lever parts and the substrate surface. It transfers the movement from the lever parts to the protruding portions, enabling controlled contact with the side faces. This intermediary mechanism simplifies the overall process by providing a flexible connection that accommodates the geometric constraints of side-face printing
3Ease of manufacture
If a simple mold structure is used, then the manufacturing process is easy, but it cannot form complex side-face wirings for bezel-less design
Solution Approach 1:
The mold structure is designed with multi-functionality where the same components serve multiple purposes. The lever parts can move to position different protruding portions, the bendable part adapts to different substrate geometries, and the hinge grooves enable various bending configurations. This universal design allows a single mold structure to handle complex side-face wiring formation while maintaining ease of manufacture through standardized components
Data Source
AI summary
A mold for printing a wiring includes: a bendable part between a first lever part and a second lever part; a first protruding portion protruding from a top face of the bendable part; a second protruding portion protruding from the top face of the bendable part and at one side of the first protruding portion; and a third protruding portion protruding from the top face of the bendable part and at the other side of the first protruding portion. The first and second protruding portions are spaced apart from each other with a first hinge groove therebetween, the first and third protruding portions are spaced apart from each other with a second hinge groove therebetween, and a width of each of the first and second hinge grooves increases as they respectively extends upwardly in the thickness direction.