Bending Area Display Apparatus Stress Buffering
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Solution Overview
Problem
Display apparatuses face defects such as disconnections during manufacturing, particularly when bent, due to tensile stress on conductive layers, which can lead to cracks and reduced lifespan.
Innovation Solution
Incorporating an organic material layer with a central portion thicker than the peripheral portion between the inorganic insulating layer and the conductive layer, where the organic material layer buffers tensile stress, and the conductive layer is designed with a wavy pattern and uneven surface to reduce stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the display apparatus is bent to enhance visibility or decrease size, then adaptability is improved, but manufacturing defects such as disconnections occur due to tensile stress on conductive layers
Solution Approach 1:
An organic material layer is introduced as an intermediary between the inorganic insulating layer and the first conductive layer. This organic layer acts as a stress buffer that absorbs tensile stress during bending, preventing direct stress transmission to the conductive layer and thereby reducing disconnection defects while maintaining bending capability
Solution Approach 2:
The thickness of the organic material layer is varied across different regions: the central portion (overlapping the bending area) has a greater average thickness than the peripheral portion. This gradient thickness design optimizes stress distribution, providing enhanced buffering capacity where bending stress is most intense while maintaining structural integrity elsewhere
2Reliability
If the conductive layer is made thicker to reduce defects, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
Rather than increasing conductive layer thickness, an organic material layer is inserted as a mediator between the inorganic insulating layer and the conductive layer. This approach improves defect resistance by stress buffering without requiring thicker conductive layers, thereby avoiding increased manufacturing complexity associated with thicker metal layers
Solution Approach 2:
The organic material layer's thickness is locally optimized: the central portion has greater thickness for stress buffering in the bending area, while the peripheral portion has reduced thickness. This local differentiation provides targeted protection where needed without uniformly increasing overall structure complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes the occurrence of defects like disconnections and extends the lifespan of the display apparatus by effectively absorbing and distributing tensile stress during bending.
Implementation Method 1
an organic material layer arranged between the inorganic insulating layer and the first conductive layer, and including a central portion and a peripheral portion. The central portion overlaps with the bending area. The peripheral portion extends from the central portion and does not overlap with the bending area. An average thickness of the central portion is greater than an average thickness of the peripheral portion.
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A display apparatus (300) includes a substrate (100), an inorganic insulating layer (110, 120, 130), a first conductive layer (215c), and an organic material layer (160). The substrate (100) includes a first area (1A), a second area (2A), and a bending area (BA) located between the first area (1A) and the second area (1A). The bending area (BA) is configured to be bent about a first bending axis (BAX) extending in a first direction. The inorganic insulating layer (110, 120, 130) is arranged over the substrate (100). The first conductive layer (215c) extends from the first area (1A) to the second area (2A) passing over the bending area (BA), and is arranged over the inorganic insulating layer (110, 120, 130). The organic material layer (160) is arranged between the inorganic insulating layer (110, 120, 130) and the first conductive layer (215c) and includes a central portion (160a) overlapping the bending area (BA) and a peripheral portion (160b) extending from the central portion (160a). An average thickness of the central portion (160a) is greater than an average thickness of the peripheral portion (160b).