Precision Bending Bar for Semiconductor Wafer Breaking
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Solution Overview
Problem
Existing methods for breaking brittle semiconductor wafers require precise alignment and adjustment of breaking apparatus to accommodate varying die pitches and materials, leading to increased setup time and difficulty in handling smaller wafer sizes, which complicates the process of separating individual dies without damaging sensitive components.
Innovation Solution
A method and apparatus using a precision bending bar and a vertically movable compressive member with a urethane material of uniform Shore A durometer, allowing for controlled force application and alignment tolerance, enabling efficient breaking along scribe lines with reduced need for precise alignment and easy setup for different wafer pitches and materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If precise alignment between scribe line and breaking mechanism is used, then breaking accuracy is improved, but setup time and device complexity increase
Solution Approach 1:
The patent changes the geometric parameters of the breaking mechanism by providing the V-shaped groove with adjustable dimensions and angles. The groove width, depth, and included angle can be modified to match different scribe line configurations, allowing the same mechanism to accommodate varying die pitches without requiring precise realignment or component changes.
Solution Approach 2:
The V-shaped groove design serves multiple functions: it guides the scribe line, concentrates breaking force, and accommodates different pitch variations. This universal design allows a single breaking mechanism to handle various wafer configurations, eliminating the need for multiple specialized components and reducing setup time.
2Manufacturing precision
If precise alignment between scribe line and breaking mechanism is used, then breaking accuracy is improved, but device complexity increases
Solution Approach 1:
The V-shaped groove's geometric parameters (width, depth, angle) are designed to inherently guide and center the scribe line, eliminating the need for complex alignment mechanisms. The groove acts as a self-aligning feature that simplifies the overall device structure while maintaining breaking accuracy.
3Productivity
If breaking force is increased to break smaller wafers, then breaking effectiveness is improved, but risk of damaging sensitive components increases
Solution Approach 1:
The V-shaped groove concentrates the breaking force locally at the scribe line interface, applying high stress precisely where needed to initiate and propagate the break. This localized force concentration allows effective breaking of smaller wafers while avoiding excessive force application to other areas, thereby protecting sensitive components from damage.
4Adaptability or versatility
If adjustable breaking force mechanism is used, then adaptability to different materials is improved, but device complexity increases
Solution Approach 1:
The V-shaped groove's geometric parameters can be adjusted to change the mechanical advantage and force multiplication effect. By modifying the groove dimensions and angle, the system adapts to different wafer materials and thicknesses without requiring complex active control mechanisms, achieving material adaptability through passive geometric adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the breaking process by allowing for misalignment tolerance and automated operation, reducing setup time and ensuring reliable breaking of wafers with different pitches and materials without damaging sensitive components, while accommodating various wafer sizes and materials efficiently.
Implementation Method 1
A scribe line on the wafer is aligned with a compressive member. The compressive member is moved a predetermined distance to break the wafer along the scribe line.
Data Source
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AI summary
An apparatus and method for breaking a semiconductor wafer (86) along scribe lines to separate individual die. A scribe line of the wafer (86) is aligned with a straight, elongated pyramid-shaped edge (48) of a precision bending bar (46), and a compressive force is applied to the surface of the wafer (86) by a compressive member (60) to bend the wafer (86) over the edge and break the wafer along the scribe line.