Bending Connection Lines With Protrusions and Recesses
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Solution Overview
Problem
Existing display devices face challenges in reducing the width of the bending region while maintaining a sufficient number of signal lines, as bending stress can cause fractures and defects, and existing multi-path structures either lead to short circuits or decrease line density.
Innovation Solution
A display device with a multi-path structure featuring bending connection lines that include protrusions and recesses, and line segments with varying widths, arranged in a specific pattern to increase line density and prevent damage from bending stress, allowing for a higher number of signal lines within a limited width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If signal lines are bent to reduce non-display area, then device integration is improved, but fracture and defect risk increases
Solution Approach 1:
The signal lines are divided into multiple separate paths instead of single continuous lines. Each path consists of multiple line segments connected through contact holes across different conductive layers, creating a segmented structure that distributes mechanical stress and prevents single-point failures during bending operations.
Solution Approach 2:
The patent transitions from two-dimensional planar signal lines to a three-dimensional multi-layer conductive structure. Signal lines are distributed across multiple conductive layers (first, second, and third conductive layers) with vertical connections through contact holes, utilizing the third dimension (depth/layer stacking) to achieve path redundancy and stress distribution.
2Reliability
If multi-path structure is implemented to protect signal lines, then reliability is improved, but line density decreases
Solution Approach 1:
Multiple signal paths are merged into a compact multi-layer structure where first, second, and third conductive layers are stacked vertically with contact holes providing vertical interconnections. This merging of spatial dimensions allows multiple protective paths to coexist in a small volume without proportionally increasing the footprint area.
Solution Approach 2:
The patent employs thin-film conductive structures and flexible substrate materials that can accommodate bending stresses. The conductive layers are formed as thin films that maintain electrical connectivity while flexing, allowing the multi-path structure to remain compact and maintain high line density even with redundant protective pathways.
3Area of stationary object
If bending region width is reduced to increase display area, then display area is improved, but signal line capacity decreases
Solution Approach 1:
The patent resolves the space constraint by transitioning from horizontal signal line expansion to vertical multi-layer stacking. Multiple signal paths are arranged across different conductive layers (first, second, third layers) connected by vertical contact holes, effectively utilizing the third dimension (z-axis) to increase signal line capacity without increasing the horizontal bending region width.
Solution Approach 2:
The patent changes the structural parameters of signal lines by varying line widths, spacing, and layer configurations across different conductive layers. This parameter optimization allows maximum signal line capacity to be achieved within the constrained bending region width, maintaining high line density while accommodating multiple protective paths.
Data Source
AI summary
A display device including a substrate having a first region, a second region, and a bending region disposed between the first region and the second region; and a plurality of bending connection lines disposed on the substrate in the bending region and extended in a first direction. Each of the bending connection lines includes a protrusion in a second direction and a recess depressed from the protrusion, and the protrusion of each of the bending connection lines faces the recess of the bending connection lines next thereto.