Bending Display Panel Support via Segmented Flexible Circuit Boards

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Solution Overview

Problem

Existing display devices with bending panels face challenges in maintaining structural integrity and image quality due to the complexity of integrating flexible circuit boards and supports that can withstand bending without compromising display performance.

Innovation Solution

A display device design featuring a display panel with a first non-bending portion, a bending portion, and a second non-bending portion, supported by a flexible circuit board and a lower support structure that includes a cushion layer, a heat dissipation layer, and a lower adhesive layer with protruding patterns, ensuring effective bending and structural stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a bending display panel is used to enable flexible display devices, then adaptability and form factor are improved, but structural integrity and reliability deteriorate due to the complexity of integrating flexible circuit boards and supports that can withstand bending

Engineering Contradiction:
ImproveflexibilityVSAvoidstructural integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The display panel is divided into a bending portion and non-bending portions, allowing selective flexibility. The flexible circuit board is segmented into regions with different flexibility characteristics, with some areas designed to bend and others to remain rigid for structural support. This segmentation enables the device to achieve flexibility where needed while maintaining structural integrity elsewhere.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the display device are assigned different mechanical properties. The bending portion of the display panel has high flexibility, while the non-bending portions maintain rigid characteristics. The lower support structure includes regions with different stiffness to provide localized support during bending, ensuring structural integrity is maintained in critical areas while allowing flexibility in designated regions.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If flexible circuit boards are integrated into bending display panels to maintain electrical connectivity during bending, then adaptability is improved, but device complexity increases due to the need for multiple supports and adhesive configurations

Engineering Contradiction:
ImproveflexibilityVSAvoidintegration complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The lower support structure serves multiple functions simultaneously: it provides mechanical support during bending, acts as a mounting platform for the flexible circuit board, provides heat dissipation pathways, and serves as an adhesive mounting surface. This multi-functionality reduces the need for separate components and simplifies the overall integration of flexible circuit boards into bending display panels.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

An adhesive layer is introduced as an intermediary between the lower support structure and the flexible circuit board. This adhesive layer facilitates reliable bonding while accommodating the flexibility requirements of the bending display panel, simplifying the integration process by providing a dedicated interface that handles both mechanical and electrical connection needs.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If adhesive layers are used to secure flexible circuit boards to lower supports in bending display panels, then reliability is improved, but manufacturing precision requirements increase due to the need for precise adhesive placement and thickness control

Engineering Contradiction:
Improvebonding strengthVSAvoidadhesive placement precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The adhesive layer is applied to the lower support structure before the flexible circuit board is mounted. This preliminary action allows for precise control of adhesive placement and thickness during the manufacturing process, ensuring reliable bonding while simplifying subsequent assembly operations. The adhesive is positioned in advance to align with the flexible circuit board's connection points and structural features.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed design enhances the structural integrity and image quality of bending display devices by providing a robust support system that maintains flexibility while preventing deformation and visibility issues, thus improving user experience.

Implementation Method 1

a heat dissipation layer disposed under the cushion layer and including stainless steel

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an adhesive tape disposed on a lower surface of the lower support and a lower surface of the second flexible circuit board

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20250057030A1Display device having a bending display panel
Publication Date: 2025.02.13 SAMSUNG DISPLAY CO LTD
  • US20250057030A1 patent drawing
  • US20250057030A1 patent drawing
  • US20250057030A1 patent drawing

AI summary

A display device includes a display panel including a first non-bending portion, a bending portion, and a second non-bending portion. A flexible circuit board includes a first flexible circuit board disposed on an upper surface of the second non-bending portion and a second flexible circuit board disposed on a lower surface of the second non-bending portion. A lower support is disposed under the first non-bending portion. An adhesive tape is disposed on a lower surface of the lower support and a lower surface of the second flexible circuit board when the bending portion is bent. The adhesive tape disposed on the lower surface of the second flexible circuit board is disposed at an edge of the second flexible circuit board.