Bending Meshing Gear Thermal Conduction for Low-Cost Durability
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Solution Overview
Problem
Existing bending meshing type gear devices face challenges in achieving a balance between durability and cost, particularly due to the high cost of PEEK resin used for meshing gears, which is optimal for durability but expensive, and the issue of heat-generated durability damage when reducing resin thermostability for cost savings.
Innovation Solution
The gear device incorporates a meshing gear formed from a resin with a glass transition point lower than 140°C, a bending gear made of a high thermal conductivity material, and a wave generator with even higher thermal conductivity than the bending gear, promoting heat dissipation and reducing temperature and durability impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PEEK resin is used for meshing gear to ensure durability, then durability is improved, but cost increases significantly
Solution Approach 1:
The patent applies this principle by using a cheaper resin material with glass transition point of 100°C or higher (such as polyacetal, polyamide, or polyphenylene sulfide) instead of expensive PEEK resin for the meshing gear. The cost is reduced while maintaining sufficient durability through proper material selection within the specified glass transition temperature range.
Solution Approach 2:
The patent applies this principle by changing the material parameter (glass transition point) from PEEK's high glass transition point to a range of 100°C or higher but lower than PEEK. This parameter change allows use of cheaper materials while maintaining the necessary thermal performance for durability.
2Ease of manufacture
If resin with lower glass transition point is used to reduce cost, then cost is reduced, but heat-generated durability damage increases
Solution Approach 1:
The patent applies this principle by precisely controlling the glass transition point parameter within the range of 100°C or higher. This parameter optimization ensures the resin maintains sufficient heat resistance for durability while allowing use of cheaper materials compared to PEEK.
Solution Approach 2:
The patent applies this principle by using composite material structures where the meshing gear uses a optimized resin material selected from specific types (polyacetal, polyamide, polyphenylene sulfide) that balance cost and thermal performance, rather than using pure expensive PEEK.
3Temperature
If wave generator and bending gear have high thermal conductivity to improve heat dissipation, then temperature is reduced, but device complexity increases
Solution Approach 1:
The patent applies this principle by changing the material parameter (thermal conductivity) of the wave generator and bending gear to 10 W/(m·K) or higher. This parameter change improves heat dissipation capability and reduces operating temperature while using conventional materials that do not significantly increase device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the effect of heat on durability while achieving a low cost for the meshing gear, enhancing thermal dissipation and maintaining gear performance.
Implementation Method 1
the bending gear is formed of a first high thermal conductivity material having higher thermal conductivity than the first resin, and the wave generator is formed of a second high thermal conductivity material having higher thermal conductivity than the first high thermal conductivity material
Data Source
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AI summary
A bending meshing type gear device (10) that can suppress an effect on durability of a meshing gear (16A, 16B) while achieving a low cost of the meshing gear (16A, 16B) is provided. A bending meshing type gear device (10) includes a wave generator (12), a bending gear (14) that is bent and deformed by the wave generator (12), and a meshing gear (16A, 16B) that meshes with the bending gear (14), in which the meshing gear (16A, 16B) is formed of a first resin having a glass transition point lower than 140°C, the bending gear (14) is formed of a first high thermal conductivity material having higher thermal conductivity than the first resin, and the wave generator (12) is formed of a second high thermal conductivity material having higher thermal conductivity than the first high thermal conductivity material.