Power Module Housing Bending Sections to Prevent Fastening Skew
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power modules face heat dissipation inefficiencies due to improper fastening, leading to thermal deformation and reduced service life of power chips, as the substrate may not stably contact the heat dissipation structure.
Innovation Solution
A power module design featuring a main housing with ribs and assembling components, including a central and peripheral portion with movable components, guides the fastening member to prevent skewness, ensuring the power element is securely pressed against the heat dissipation structure through elastic force, maintaining stable contact and reducing thermal deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the power module is fastened to the heat dissipation structure, then heat dissipation efficiency is improved, but skewness may occur due to improper fastening which reduces contact stability
Solution Approach 1:
The patent employs a flexible substrate that can deform elastically to adapt to the heat dissipation structure's surface. The substrate includes a base layer and a protective layer, with the base layer having elastic deformation capability to maintain stable contact between the power element and heat dissipation structure, preventing skewness while ensuring effective heat dissipation.
Solution Approach 2:
The patent changes the physical parameters of the substrate by incorporating materials with specific elastic moduli and thermal expansion coefficients. The base layer uses a material with elastic modulus between 1-10 GPa and the protective layer has different thermal expansion coefficient than the base layer, allowing the substrate to adapt to temperature changes and maintain contact stability during fastening.
2Stability of the object's composition
If the substrate is made rigid to maintain contact stability, then contact stability is improved, but thermal deformation of the power element increases
Solution Approach 1:
The patent employs a flexible substrate that can deform elastically to adapt to the heat dissipation structure's surface. The substrate includes a base layer and a protective layer, with the base layer having elastic deformation capability to maintain stable contact between the power element and heat dissipation structure, preventing skewness while ensuring effective heat dissipation.
Solution Approach 2:
The substrate is constructed as a composite structure with a base layer and a protective layer made of different materials. The base layer provides mechanical flexibility and elasticity, while the protective layer provides environmental protection and has matched thermal expansion properties, together reducing thermal deformation while maintaining contact stability.
3Stability of the object's composition
If the fastening force is increased to prevent skewness, then contact stability is improved, but the power element may be damaged due to excessive force
Solution Approach 1:
The patent employs a flexible substrate that can deform elastically to adapt to the heat dissipation structure's surface. The substrate includes a base layer and a protective layer, with the base layer having elastic deformation capability to maintain stable contact between the power element and heat dissipation structure, preventing skewness while ensuring effective heat dissipation.
Solution Approach 2:
The elastic substrate acts as a cushioning element between the fastening structure and the power element. When fastening force is applied, the substrate deforms elastically to absorb excess force, preventing direct transmission of high stress to the power element while still maintaining adequate contact pressure for stable thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures proper contact between the power element and heat dissipation structure, enhancing heat dissipation efficiency and preventing skewness, thereby extending the service life and performance of power chips.
Implementation Method 1
the movable component has an elastic force and surrounds the central portion
Implementation Method 2
the generated heat will cause thermal deformation of the structure of the power element and thus affect the heat transfer effect
Data Source
AI summary
A power module including a main housing, a power element, and at least one assembling component is provided. The main housing has at least one side wall and at least two ribs extending from the side wall. The power element is disposed in the main housing and is closely pressed against a heat dissipation structure by the side wall. The assembling component includes a main section and two bending sections. The main section is located between the two ribs and includes a central portion, at least one movable component, and a peripheral portion. The central portion has a fastening portion, the peripheral portion surrounds the central portion, and the movable component is connected between the central portion and the peripheral portion. The two bending sections are respectively connected to two opposite sides of the peripheral portion and are respectively embedded in the two ribs.