Bending Stress Testing for Thin Electronic Substrates
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Solution Overview
Problem
Conventional substrate thinning techniques for electronic devices result in reduced bending strength and increased risk of stress concentration due to defects during cutting, necessitating a reliable method for measuring bending stress to ensure safety during manufacturing and product application.
Innovation Solution
A testing method and apparatus that apply a force to a testing sample until it breaks, using finite element analysis to determine the maximum principle stress value, allowing for accurate assessment of bending stress strength and determining the safety of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If substrate thinning is performed to decrease weight and thickness, then the device achieves lightness and slimness, but the bending strength and structure strength of the substrate are decreased
Solution Approach 1:
The patent changes the testing parameters by applying controlled forces at specific locations (two ends and center point) to simulate real-world bending conditions. By systematically varying the force application method and measuring corresponding stress values, the patent establishes safety criteria for thin substrates without requiring actual thickness increases.
2Manufacturing precision
If substrate is cut to required size, then the desired dimensions are achieved, but cutting defects such as scars, cracks or foreign bodies are introduced causing stress concentration
Solution Approach 1:
The patent performs preliminary testing on substrate samples before actual manufacturing to identify and quantify cutting defects. By pre-testing and measuring stress concentration at defect locations, the patent can determine safe manufacturing criteria and reject defective substrates before they cause failures in the final product.
Solution Approach 2:
The patent replaces direct mechanical cutting with a stress analysis approach using finite element method simulations. Instead of physically cutting every substrate and inspecting for defects, the system uses computational mechanics to predict stress distribution and identify potential failure points based on simulated cutting conditions.
3Measurement precision
If quantitative measurement of bending stress is performed to assess substrate safety, then accurate testing results are obtained, but the testing process becomes complex and time-consuming
Solution Approach 1:
The patent creates simplified testing models using standard substrate samples with controlled dimensions and defect conditions. Instead of testing every actual substrate, the system uses representative sample models that replicate the critical testing scenarios, making the measurement process more manageable while maintaining accuracy through standardized procedures.
Solution Approach 2:
The patent simplifies the testing process by focusing on key parameter measurements (force values at specific locations, resulting stress values) rather than comprehensive complex analysis. By changing the approach to measure only critical parameters and using pre-established safety criteria, the patent reduces testing complexity while maintaining sufficient accuracy for safety assessment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a simple, fast, and effective method to quantify bending stress, ensuring the structural integrity of substrates by identifying safe manufacturing and application conditions.
Implementation Method 1
a force is applied on two ends of the testing sample to bend the testing sample
Data Source
AI summary
A testing method of bending stress and a testing apparatus thereof are provided. The method includes the following steps. A stress distribution model of a structure to be tested is built. Next, a testing sample of the structure to be tested is provided, and a force is applied on two ends of the testing sample to bend the testing sample till it breaks at a breaking point, so as to obtain a first distance between the two ends of the testing sample when the testing sample breaks, or a second distance from the breaking point to a closer end of the two ends. Next, a maximum principle stress value of the stress distribution model or a break point principle stress value at the breaking point of the stress distribution model is obtained according to the first distance or the second distance.