Bending Area Wire Routing for Flexible Display Defect Reduction

The patent applies flexible thin film structures by making the insulation layer and organic material layer thin enough to allow bending without cracking. The insulation layer has a thickness of 100-500 nm and the organic material layer has a thickness of 50-200 nm, enabling the display apparatus to be bent into various shapes (U-shape, V-shape, zigzag) without causing defects in the bending area.

The patent changes the physical parameters of the materials used in the bending area. Specifically, it selects materials with appropriate mechanical properties (flexibility, tensile strength) and controls their thickness parameters. The organic material layer uses materials with elongation at break of 20-50% to accommodate bending stresses, while the insulation layer thickness is optimized to balance mechanical strength and flexibility.

The patent extracts and eliminates the contact hole structure from the bending area. Instead of creating a contact hole to connect wires across the bending area, the design allows wires to extend continuously through the bending area without interruption, removing the stress concentration point that would otherwise exist at the contact hole location.

The patent performs preliminary routing of wires to extend continuously across the bending area before the bending process occurs. This preliminary arrangement ensures that wires are positioned to follow the bending contour, preventing stress concentration and defects that would occur if wires were connected after bending using contact holes.

The patent employs composite material structures where the insulation layer and organic material layer are combined with specific thickness ratios. The insulation layer (100-500 nm) provides mechanical strength while the organic material layer (50-200 nm) provides flexibility and stress absorption. This composite structure achieves both structural strength and bending flexibility without causing defects.

The patent changes the material parameters by selecting organic materials with specific mechanical properties (elongation at break of 20-50%, tensile strength of 10-50 MPa) and controlling layer thicknesses precisely. These parameter changes enable the structure to withstand bending stresses without cracking while maintaining adequate mechanical strength for device operation.