Bent Semiconductor Chip Packaging for Multi-Level Connections
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Solution Overview
Problem
Conventional packaging methods for semiconductor chips face challenges in efficiently bridging height differences between chips and connection entities, often requiring additional components like clips or bond wires, which increase complexity and reduce package compactness and signal quality.
Innovation Solution
The method involves bending or flexing extremely thin semiconductor chips to create curvature, allowing them to connect at multiple vertical levels without additional bridging components, thereby simplifying packaging and reducing electrical path lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional packaging methods are used with additional bridging components, then height differences between chips and connection entities can be bridged, but device complexity increases and manufacturing precision deteriorates
Solution Approach 1:
The patent changes the physical state of the semiconductor chip from rigid to flexible by reducing its thickness to extremely thin dimensions (few micrometers). This parameter change enables the chip to be bent into curved configurations, allowing it to adapt to height differences between connection entities without requiring additional bridging components, thus resolving the technical contradiction between adaptability and device complexity
Solution Approach 2:
Instead of adding external bridging components to connect chips at different heights, the invention inverts the approach by making the chip itself flexible and bendable. The chip is bent to create curvature that bridges the height difference, eliminating the need for separate bridging structures and thereby reducing packaging complexity while maintaining adaptability
2Adaptability or versatility
If additional bridging components are used, then height differences can be bridged, but manufacturing precision and signal quality deteriorate
Solution Approach 1:
The patent extracts and eliminates the additional bridging components (clips, bond wires, etc.) from the packaging structure. By making the semiconductor chip itself flexible and bendable, the invention removes the need for separate bridging elements, thereby improving manufacturing precision and signal quality while maintaining the ability to bridge height differences through the bent chip configuration
3Ease of manufacture
If semiconductor chips are made extremely thin to enable bending, then ease of manufacture improves, but mechanical strength deteriorates
Solution Approach 1:
The patent changes the thickness parameter of the semiconductor chip to extremely thin dimensions (few micrometers) to enable bending and flexibility. This parameter change is achieved through advanced thinning processes that maintain structural integrity. The extreme thinness allows the chip to be bent into curved configurations for bridging height differences, while the manufacturing processes ensure that the mechanical strength is sufficient for the intended application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more compact, reliable, and high-performance package with reduced manufacturing effort, lower signal losses, and improved signal quality by directly coupling semiconductor chips at different height levels.
Implementation Method 1
bending or flexing extremely thin semiconductor chips to create curvature
Data Source
AI summary
A package is disclosed. In one example, the package comprises a carrier, a semiconductor chip having a first connection area at which the semiconductor chip is mounted at a first vertical level on or above the carrier, and a connection body. The semiconductor chip is bent to thereby be connected at a second connection area of the semiconductor chip at a second vertical level, being different from the first vertical level, with the connection body.