Bent Connection Conductor Sensor Device for Mechanical Stability
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Solution Overview
Problem
Conventional sensor devices face challenges in achieving mechanical stability and simplified production methods, particularly during the bending of connection conductors, which can lead to mechanical stresses, damage, and increased production complexity.
Innovation Solution
The sensor device incorporates a magnetic field sensor component with a chip carrier and a magnet featuring a mounting surface with an elevation, allowing the connection conductor to be bent around it, thereby reducing mechanical stresses and eliminating the need for clamping tools, and optionally includes a depression to secure the component, preventing translation and rotation, thus enhancing stability and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If connection conductors are bent during assembly, then electrical connections are established, but mechanical stresses and damage occur
Solution Approach 1:
The elevation is pre-formed on the magnet surface before the connection conductor is bent. This preliminary structural preparation provides a ready-made support that guides the bending process and distributes mechanical stresses, preventing damage to the connection conductor while maintaining assembly simplicity.
Solution Approach 2:
The elevation acts as an intermediary element between the connection conductor and the magnet. It mediates the mechanical stress during bending by providing a support surface, thereby protecting the connection conductor from direct stress concentration and potential damage while still enabling electrical connection establishment.
2Reliability
If clamping tools are used to secure components, then mechanical stability is improved, but device complexity and production cost increase
Solution Approach 1:
The magnet's elevation serves a dual function: it provides structural support for bending the connection conductor and simultaneously acts as a mechanical stop to prevent excessive movement of the magnetic field sensor component. This self-service feature eliminates the need for separate clamping tools, reducing device complexity while maintaining mechanical stability.
Solution Approach 2:
The elevation is designed to perform multiple functions: supporting the connection conductor during bending, preventing translation of the sensor component, and serving as a reference for alignment. This multi-functionality replaces what would otherwise require multiple separate components or tools, simplifying the overall device structure.
3Ease of manufacture
If the mounting surface is flat, then manufacturing is simpler, but alignment precision and stability decrease
Solution Approach 1:
Instead of making the entire mounting surface complex, only a local elevation is added to the otherwise simple flat surface. This localized structural modification provides precise alignment reference and stability where needed, while the rest of the mounting surface remains simple for easy manufacturing.
Data Source
AI summary
A sensor device includes a magnetic field sensor component, including a chip carrier having a connection conductor and a magnetic field sensor chip arranged on the chip carrier, and a magnet, wherein the magnetic field sensor component is arranged on a mounting surface of the magnet, wherein the mounting surface has an elevation and the connection conductor is bent around the elevation.