Bent Connection Conductors for Module Terminal Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing method for manufacturing modules with interlayer connection conductors results in unstable connections between terminal assemblies and substrates, leading to reliability issues and potential disconnection of terminals from the sealing resin layer.
Innovation Solution
The module design includes a connection conductor with a substrate connecting portion formed by bending an end portion, increasing the connection area between the conductor and substrate, and optionally integrating terminal blocks to form a shield wall, which also serves as an external connection terminal, eliminating the need for via holes and simplifying manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a terminal assembly with small connection area is mounted onto the substrate, then the manufacturing process is simple, but the connection reliability between the terminal assembly and substrate becomes unstable
Solution Approach 1:
The connection conductor is extended from a simple planar terminal assembly into a three-dimensional structure with a substrate connecting portion that bends downward to contact the substrate surface. This dimensional extension increases the connection area from a small surface contact to a larger area involving the bent portion, thereby improving connection reliability while maintaining manufacturing simplicity
Solution Approach 2:
The substrate connecting portion is formed by bending the end portion of the connection conductor into a curved or bent shape. This curvature allows the conductor to conform to the substrate surface and increase the contact area, improving connection stability without complicating the manufacturing process
2Productivity
If the connecting portion is removed after mounting the terminal assembly, then via holes are eliminated and manufacturing time is reduced, but the terminals may come off the sealing resin layer
Solution Approach 1:
The substrate connecting portion is designed in advance to provide mechanical support and anchoring for the terminal assembly. By pre-forming this bent connecting portion that extends onto the substrate surface, the structure creates a cushioning effect that prevents the terminals from detaching from the sealing resin layer after the connecting portion is removed, thereby maintaining reliability while enabling faster manufacturing
3Reliability
If the connection area between terminal and substrate is increased, then connection reliability is improved, but the device complexity increases
Solution Approach 1:
The connection conductor is segmented into distinct functional portions: a terminal assembly portion for electrical connection and a substrate connecting portion for mechanical anchoring. This segmentation allows the increased connection area to be achieved through a simple bent extension rather than a complex integrated structure, maintaining device simplicity while improving reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the module by increasing the connection area and preventing terminal disconnection, reduces manufacturing costs and time, and facilitates mass production, even with complex or large modules with multiple terminals.
Implementation Method 1
a substrate connecting portion that is formed by bending an end portion of the connection conductor
Implementation Method 2
a first sealing resin layer that covers the first main surface, the component, and the connection conductor
Data Source
AI summary
A module includes components on an upper surface and a lower surface of a substrate, a second sealing resin layer laminated on the upper surface of the substrate, a first sealing resin layer on the lower surface of the substrate, and terminal blocks on the lower surface of the substrate. Each of the terminal blocks is formed by integrating a plurality of connection conductors, each of the plurality of connection conductors including a terminal portion and a substrate connecting portion formed by bending an end portion of the connection conductor, and each of the terminal blocks forms an external connection terminal of the module or functions as a shield wall for the components. Each of the terminal blocks 6 can be formed by mounting a terminal assembly onto the lower surface of the substrate, sealing the terminal assembly with a resin, and removing connecting portions.