Bent Electrode Terminals for Wiring Substrates

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Solution Overview

Problem

The increasing miniaturization and higher terminal count of semiconductor elements on wiring substrates lead to narrower pitches of external connection terminals, causing potential short-circuiting and current leakage due to the conductive member running off between adjacent connection portions, which compromises the reliability of electric connections.

Innovation Solution

The design incorporates electrode terminals with a first linear portion, a second linear portion extending at a different direction, and a bent portion where they connect, with the conductive member having a greater thickness at the bent portion to ensure stable connections and prevent short-circuiting, even when the pitch is narrowed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the pitch of external connection terminals is narrowed to achieve high-density mounting, then the mounting density increases, but the space between adjacent conductive layers decreases causing short-circuiting and current leakage

Engineering Contradiction:
Improvemounting densityVSAvoidconnection reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The electrode terminal is designed with a bent portion that extends in a direction different from the first linear portion, effectively utilizing three-dimensional space. This dimensional change allows the terminal to navigate around obstacles and maintain proper spacing even when pitch is narrowed, preventing short-circuits while achieving high-density mounting

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The bent portion of the electrode terminal introduces curvature to the otherwise linear path. This curvature allows the conductive member to follow a non-linear trajectory, increasing the effective distance between adjacent connection points and preventing current leakage while maintaining compact layout

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Reliability

If the conductive member thickness is increased at the bent portion to prevent running off, then connection stability improves, but the manufacturing complexity increases

Engineering Contradiction:
Improveconnection stabilityVSAvoidconductive member structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive member is designed with varying thickness along its length, with the thickest portion specifically at the bent section. This local quality change provides enhanced stability where needed (at the bent portion) while maintaining thinner sections elsewhere, optimizing both reliability and manufacturing efficiency

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS8125789B2Wiring substrate and electronic device
Publication Date: 2012.02.28 SOCIONEXT INC
  • US8125789B2 patent drawing
  • US8125789B2 patent drawing
  • US8125789B2 patent drawing

AI summary

A wiring substrate includes a plurality of electrode terminals, to which external connection terminals of an electronic component are coupled, arranged in a row on one principal surface thereof, wherein the electrode terminals each include: a first linear portion; a second linear portion extending from an end of the first linear portion in a direction different from a direction of the first linear portion; and a bent portion that is a part where the first linear portion and the second linear portion are connected.