Bent Flow Channel Plate for Uniform Liquid Cooling Across Chips

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Solution Overview

Problem

Conventional liquid cooling systems for high-performance computing servers face challenges in achieving temperature uniformity across chips due to non-uniform flow velocity and temperature distribution, particularly under high computation workloads.

Innovation Solution

A medium flow channel with sequentially bent sub-sections and connecting sections, incorporating convex curved panels as flow guiding structures to ensure smooth medium flow and consistent temperature distribution, using heat dissipation fins to divide the channel into sub-sections and maintain gaps to minimize turbulence and bubble formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If conventional liquid cooling schemes with heat dissipation fins are used, then heat dissipation capability is improved, but temperature uniformity across chips deteriorates

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidtemperature uniformity
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The patent introduces convex curved panels with arcuate or parabolic surfaces in the connecting sections of the flow channel. These curved surfaces guide the liquid medium to flow smoothly along the channel walls, preventing dead zones and ensuring uniform temperature distribution across all chips while maintaining effective heat dissipation through the fins.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Power

If heat dissipation fins are added in flow channels, then heat transfer efficiency is improved, but flow velocity uniformity deteriorates

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidflow velocity uniformity
Core Design Contradiction:
PowerVSSpeed

Solution Approach 1:

The convex curved panels create a streamlined flow path that maintains consistent flow velocity across the channel width. The curved geometry prevents flow separation and turbulence that would otherwise occur with sharp corners, ensuring uniform velocity distribution that complements the heat dissipation fins' function.

Inventive Principle:
Principle #14Spheroidality (Curvature)

3Device complexity

If conventional flow channel designs are used, then device complexity is reduced, but temperature consistency across chips deteriorates

Engineering Contradiction:
Improveflow channel structure simplicityVSAvoidtemperature consistency
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The convex curved panels are integrated into the connecting sections of the flow channel, adding minimal structural complexity. The curved surfaces can be formed through standard manufacturing processes and work in conjunction with existing heat dissipation fins, achieving improved temperature consistency without substantially increasing device complexity.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances temperature consistency and flow velocity uniformity across the width of the flow channel, improving heat dissipation efficiency and extending the operational lifespan of liquid-cooled servers.

Implementation Method 1

the flow guiding structure including a convex curved panel, wherein the convex curved panel protrudes towards an outer wall of a flow channel of the connecting section where the convex curved panel is disposed, and a gap is maintained between the convex curved panel and the heat dissipation fins disposed in the sub-sections upstream and downstream of the convex curved panel

Methodology Applied
Scientific EffectFlow guidance through curved surfaces:

Implementation Method 2

a plurality of heat dissipation fins are juxtaposed in each of the sub-sections, each of the heat dissipation fins extending along an extension direction of the sub-section in which the heat dissipation fins are disposed and dividing the sub-section into a plurality of juxtaposed sub-flow channels

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

each of the sub-sections is in correspondence with at least one row of the chips, and a plurality of heat dissipation fins are juxtaposed in each of the sub-sections

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP4668055A1Medium flow channel, flow channel plate, liquid-cooled server, and data center
Publication Date: 2025.12.24 BITDEER SEMICONDUCTOR TECHNOLOGY PTE LTD
  • EP4668055A1 patent drawingFigure 1
  • EP4668055A1 patent drawingFigure 2~3
  • EP4668055A1 patent drawingFigure 4

AI summary

Disclosed are a medium flow channel, a flow channel plate, a liquid-cooled server, and a data center. The medium flow channel includes: at least two sub-sections sequentially bent and connected, and connecting sections connecting adjacent sub-sections; wherein a plurality of heat dissipation fins are juxtaposed in each of the sub-sections, each of the heat dissipation fins extending along an extension direction of the sub-section in which the heat dissipation fins are disposed and dividing the sub-section into a plurality of juxtaposed sub-flow channels.