Semiconductor Storage Device Using Bent FPC for Board Density
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Solution Overview
Problem
Current semiconductor storage devices face challenges in increasing memory capacity and improving repairability due to limitations in board density and ease of component replacement, particularly when using anisotropic conductive films (ACF) or board-to-board connectors.
Innovation Solution
The semiconductor storage device employs flexible printed circuit (FPC) boards that are bent and fixed to rigid boards using solder portions, allowing for higher board density and easier replacement by connecting multiple rigid boards directly, reducing wiring length and enhancing signal quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If ACF or board-to-board connectors are used to connect boards, then ease of assembly is improved, but board density and repairability deteriorate
Solution Approach 1:
The device is divided into multiple independent rigid boards (first rigid board, second rigid board, third rigid board) that can be separately manufactured and assembled. Each board contains specific components (controller, memory chips) and can be independently replaced, enabling high board density while maintaining ease of assembly through modular construction
Solution Approach 2:
The patent replaces ACF (anisotropic conductive film) and board-to-board connectors with traditional soldering connections. The flexible board with soldered terminals provides a more compact connection method that increases board density while maintaining assembly feasibility through standardized soldering processes
2Ease of manufacture
If ACF or board-to-board connectors are used to connect boards, then ease of assembly is improved, but ease of repair deteriorates
Solution Approach 1:
The device is divided into multiple independent rigid boards (first rigid board, second rigid board, third rigid board) that can be separately manufactured and assembled. Each board contains specific components (controller, memory chips) and can be independently replaced, enabling high board density while maintaining ease of assembly through modular construction
Solution Approach 2:
The patent enables easy replacement of defective boards by allowing individual rigid boards to be detached and replaced. The flexible board connection with solder portions allows for board replacement without requiring complex disassembly, facilitating recovery and reuse of functional components
3Length of stationary object
If flexible board is not bent and connected directly, then wiring length is reduced, but board density deteriorates
Solution Approach 1:
The flexible board is bent into a curved configuration between the first rigid board and the second rigid board. This curvature allows the flexible board to navigate the spatial arrangement of stacked boards, reducing wiring length while maintaining compact board density through optimized routing
4Quantity of substance
If multiple rigid boards are stacked with flexible connections, then board density is improved, but heat dissipation deteriorates
Solution Approach 1:
The device is divided into multiple independent rigid boards (first rigid board, second rigid board, third rigid board) that can be separately manufactured and assembled. Each board contains specific components (controller, memory chips) and can be independently replaced, enabling high board density while maintaining ease of assembly through modular construction
Solution Approach 2:
The patent applies different connection methods at different locations: solder portions are used at connection points requiring thermal management, while the flexible board provides flexible routing. This localized approach to connection methodology enables both high board density and effective heat dissipation at critical areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases memory capacity, improves repairability by allowing for easier detachment and replacement of defective boards, and enhances heat dissipation and signal quality through optimized board arrangement and connection.
Implementation Method 1
flexible printed circuit (FPC) boards that are bent and fixed to rigid boards using solder portions
Data Source
AI summary
According to one embodiment a semiconductor storage device includes a housing, a first rigid board, a controller, a second rigid hoard, a first semiconductor memory component, and a first connection board. The first rigid board includes a plurality of first terminals on a surface of the first rigid board. The second rigid board includes a plurality of second terminals on a surface of the second rigid board. The first connection board is in a state in which at least a part of the first connection board is bent. The first connection board includes a first end portion and a second end portion. The first end portion includes a plurality of third terminals connected to the plurality of first terminals of the first rigid board. The second end portion includes a plurality of fourth terminals connected to the plurality of second terminals of the second rigid board.