Bent-Guide Substrate Chuck for Warped Wafer Edge Gripping
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Solution Overview
Problem
Conventional substrate gripping apparatuses face challenges in reliably gripping substrates of varying thicknesses and warped shapes, leading to instability and reduced cleaning or drying effectiveness.
Innovation Solution
The substrate gripping apparatus features a support member with a follower pin and a bent elongated guide hole, allowing the chuck to move perpendicular to the substrate surface, enabling secure gripping of substrates regardless of thickness or warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the overlap amount L is increased to improve substrate gripping stability, then the cleaning region of the substrate decreases
Solution Approach 1:
The guide hole is designed with a bent shape including a first section and a second section that allows the chuck to dynamically adjust its position. The follower pin moves along different sections of the guide hole depending on substrate thickness, enabling the system to adapt to varying substrate dimensions while maintaining appropriate overlap amount for stable gripping.
Solution Approach 2:
The position of the chuck relative to the substrate edge is made variable through the bent guide hole structure. By changing the position of the follower pin along the guide hole (between first and second sections), the overlap amount L can be adjusted to optimize both gripping stability and cleaning region for different substrate thicknesses.
2Area of stationary object
If the chuck position is fixed to maintain consistent cleaning region, then the substrate gripping stability varies with substrate thickness
Solution Approach 1:
The guide hole transitions from a fixed straight position to a bent dynamic path, allowing the chuck to move along different trajectories. This dynamic adjustment enables the system to accommodate substrates of varying thicknesses while maintaining consistent cleaning region coverage through optimized overlap amount at each thickness level.
3Device complexity
If the chuck movable range is limited to maintain simple structure, then the chuck cannot grip warped or thick substrates
Solution Approach 1:
The guide hole is extended from a one-dimensional straight path to a two-dimensional bent path with multiple sections. This dimensional expansion allows the chuck to access positions that accommodate warped and thick substrates while maintaining a relatively simple overall structure without requiring complex mechanical systems.
4Ease of manufacture
If the guide hole is straight to simplify manufacturing, then the chuck cannot adjust position for different substrate thicknesses
Solution Approach 1:
The guide hole incorporates a bent configuration with first and second sections that provide dynamic positioning capability. While slightly more complex than a straight hole, the bent shape remains manufacturable using conventional techniques and enables the chuck to adjust its position to accommodate substrates of different thicknesses effectively.
Data Source
AI summary
A substrate gripping apparatus includes: a support member having a follower pin and a substrate support surface; a movable rod movable relatively with respect to the support member; and a chuck for gripping an edge of a substrate. The chuck has an elongated guide hole in a bent shape, and the follower pin is disposed within the elongated guide hole and is movable relatively with respect to the elongated guide hole. The elongated guide hole includes a first section, a second section, and a connecting section, the first section extends upward from the connecting section, and the second section extends in a direction different from the first section.