Bent Lead Frame Island Positioning for Bonding Wire Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face connection failure issues with bonding wires due to shape limitations and contamination from flux and outgas during the manufacturing process, leading to increased size and reliability concerns.
Innovation Solution
A semiconductor device design that includes a lead frame with a bent structure to position the island closer to the first heat sink side, reducing the connection angle and distance between semiconductor chips, and using a resin molding to integrate the components while avoiding additional manufacturing steps for passive component mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding wire connection structure is optimized to reduce connection failure, then reliability improves, but device size may increase
Solution Approach 1:
The patent positions the island in the depth direction (Z-axis) closer to the first heat sink by bending the lead frame, rather than expanding the connection area in the planar direction. This dimensional repositioning reduces the connection angle and distance without increasing the device footprint, thereby improving bonding wire reliability while maintaining compact size.
2Manufacturing precision
If the island is positioned closer to the first heat sink to reduce connection angle, then manufacturing precision improves, but the lead frame structure becomes more complex
Solution Approach 1:
The lead frame is segmented into distinct functional regions: a first heat sink region, an island region positioned closer to the first heat sink, and a control terminal region. This segmentation allows each region to be independently optimized for its function while maintaining overall structural integrity, achieving precise island positioning without excessive overall complexity.
3Productivity
If resin molding is used to integrate passive component mounting, then manufacturing efficiency improves, but the molding process complexity increases
Solution Approach 1:
The patent integrates passive component mounting into the resin molding process by providing a dedicated passive component mounting portion on the control terminal within the molding cavity. This merging of functions allows passive components to be mounted and encapsulated in a single molding operation, improving manufacturing efficiency while the modular cavity design keeps the process complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces connection failure of bonding wires and maintains a compact size, while ensuring reliable mounting of passive components without additional steps, thus enhancing the semiconductor device's reliability and efficiency.
Implementation Method 1
a resin molding configured to seal the first semiconductor chip, the second semiconductor chip, the passive component, at least a part of the first heat sink and the second heat sink, the first bonding wire, the second bonding wire, the island, and a part of the control terminal including the passive component mounting portion
Implementation Method 2
heat sinks disposed on both surfaces of the semiconductor chips and connected to main electrodes via soldering
Implementation Method 3
connected to main electrodes via soldering
Data Source
AI summary
A lead frame has a first sink, an island, and a control terminal. The lead frame is bent, and at a rear surface, the island is positioned closer to one surface of a resin molded body than the first sink and a passive component mounting portion of the control terminal. A passive component is mounted on the passive component mounting portion of the control terminal through a bonding material, the passive component mounting portion being a part of one surface.