Bent Leadframe Terminal Layout for Uniform Semiconductor Current Sharing

The patent applies asymmetry by positioning the power-source connection centrally rather than distributing terminals symmetrically. The leadframe structure features a central power terminal with semiconductor components arranged around it, creating an asymmetric layout that ensures uniform current distribution from the central source to all semiconductors, eliminating the non-uniform current distribution problem of conventional symmetric designs

The patent transitions from a planar two-dimensional terminal arrangement to a three-dimensional structure by bending the sheet metal element. The edge region is bent to bring the first electric terminal device and path section into closer proximity, creating a folded configuration that achieves uniform current distribution while managing the complexity through spatial optimization rather than increasing planar dimensions

The patent applies preliminary action by pre-machining the sheet metal element with precisely positioned terminals and path sections before the bending operation. The first electric terminal device, control terminal, and path section are pre-positioned with accurate spacing and alignment, ensuring that when the edge region is bent to shorten the leadframe, the terminal positioning precision is already established and maintained

The patent segments the leadframe manufacturing into distinct operations: pre-machining the sheet metal element with specific terminal positions and path sections, then separately bending the edge region to achieve the shortened configuration. This segmentation allows each operation to be optimized independently, maintaining manufacturing precision while achieving compact module size