Overlapping Lead Frames with Bent Leads for 3D IC Packing
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Solution Overview
Problem
Existing methods for manufacturing electronic devices with multiple integrated circuits (ICs) in a single resin package result in increased package size due to the need for larger die pads to accommodate larger ICs, leading to inefficiencies in space utilization and packaging.
Innovation Solution
The method involves using overlapping lead frames with bent leads to create a three-dimensional arrangement of ICs within a single resin package, allowing for dense packing without increasing the package size by altering the height or angle of the IC mounting surfaces, and incorporating a dam bar structure to facilitate stable resin sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If larger IC elements are mounted on the die pad, then the electrical connection capability is improved, but the required die pad area increases leading to larger package size
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration by bending leads vertically. Multiple lead frames are stacked in the vertical dimension with bent leads extending into the resin package, allowing multiple IC elements to be mounted on different levels rather than requiring a larger horizontal die pad area.
Solution Approach 2:
The patent implements a nested structure where multiple lead frames are stacked and integrated within a single resin package. The bent leads of upper lead frames are positioned within the vertical space occupied by the resin package, nesting multiple functional layers together to maximize space utilization without increasing the horizontal footprint.
2Quantity of substance
If multiple electronic parts are arranged in parallel on the die pad, then the quantity of electronic parts is increased, but the package size increases due to interference between parts
Solution Approach 1:
The patent resolves part interference by arranging electronic parts in the vertical dimension through stacked lead frames with bent leads, rather than forcing multiple parts into a single horizontal plane. This three-dimensional arrangement allows multiple parts to coexist without lateral interference while maintaining a compact package footprint.
Solution Approach 2:
The patent divides the single package space into multiple segmented levels using separate lead frames for different electronic parts. Each lead frame with its bent leads creates a distinct mounting zone, segmenting the internal space to accommodate multiple parts without them interfering with each other's electrical connections or physical space.
3Adaptability or versatility
If the area of the die pad is increased to accommodate larger or more electronic parts, then the capacity for electronic parts is improved, but the overall device size increases
Solution Approach 1:
The patent increases part capacity without increasing device footprint by utilizing the vertical dimension through bent leads and stacked lead frames. The die pad area remains compact while the bent leads extend vertically into the resin package to provide mounting surfaces for multiple electronic parts, effectively trading horizontal space for vertical space.
Solution Approach 2:
The patent uses flexible, bent leads that can be shaped to extend vertically from the compact die pad into the resin package. These thin, flexible lead structures provide the necessary electrical connections and mounting surfaces for multiple parts without requiring a larger horizontal die pad area, maintaining a compact overall device size.
Data Source
AI summary
A method of manufacturing an electronic device, the method includes: preparing a first lead frame having a first lead, the first lead having a first portion located in a first region; electrically connecting the first lead and a first electronic part; bending the first lead such that the first portion is located outside the first region; arranging a second lead frame to overlap the first lead frame such that a second portion of a second lead of the second lead frame is located in the first region; and electrically connecting the second lead and the second electronic part.