Bent Metal Substrate Circuit Unit for LED Lighting
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Solution Overview
Problem
Lighting devices with bent-type substrates face defects due to circuit damage at bent parts and damage from expanded light guide plates, leading to electrical and appearance defects, and require a solution to enhance slimness and heat dissipation.
Innovation Solution
A light source circuit unit with a metal substrate having a light source inserting hole on a printed circuit board, where the metal substrate is positioned between the light guide plate and the printed circuit board, preventing damage at bent parts and using materials like Al, Cu, Ag, Au, Cr, Mo, and Ni for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a bent-type substrate is used to direct light to the side of the light guide plate, then light emission efficiency is improved, but the insulating layer or conductive pattern may be pressed or torn causing electrical defects
Solution Approach 1:
A metal substrate with a light source inserting hole is introduced as an intermediary component between the light source element and the printed circuit board. This metal substrate serves as a protective mediator that prevents direct contact and potential damage to the insulating layer and conductive patterns during bending, while still enabling effective light transmission to the side of the light guide plate.
Solution Approach 2:
The metal substrate is positioned in advance at the bending location to provide protective cushioning before any potential damage can occur. The substrate's structure with the inserting hole is designed beforehand to accommodate the light source element while preventing the bending force from directly affecting the printed circuit board's insulating layer and conductive patterns.
2Temperature
If the light guide plate is expanded due to heat from the light source element, then heat dissipation is improved, but the light source element may come into contact with the expanded plate causing damage
Solution Approach 1:
The metal substrate acts as a protective intermediary barrier between the light source element and the light guide plate. When the light guide plate expands due to heat, the metal substrate prevents direct contact with the light source element, thereby protecting it from damage while still allowing heat to be dissipated through the system.
Solution Approach 2:
The metal substrate with the light source inserting hole is positioned in advance to create a protective buffer zone. This beforehand cushioning prevents the light source element from coming into contact with the expanded light guide plate, ensuring the element's integrity even when thermal expansion occurs.
3Length of moving object
If a bent-type substrate is used to achieve slim device profile, then device thickness is reduced, but circuit damage at bent parts may occur causing appearance defects
Solution Approach 1:
The metal substrate serves as a protective intermediary at the bending location, preventing damage to the printed circuit board's insulating layer and conductive patterns. This ensures that no foreign substances or defects are generated during the bending process, maintaining appearance quality while enabling the device to achieve a slim profile.
Solution Approach 2:
The metal substrate is positioned beforehand at the bending location to provide protective cushioning during the bending process. This prevents the printed circuit board from suffering damage that would lead to appearance defects, allowing the device to be bent into a slim configuration without compromising manufacturing precision or appearance quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents circuit damage and light source element contact with the expanded light guide plate, enhancing the slimness and heat dissipation properties of the device while reducing the risk of electrical defects and appearance issues.
Implementation Method 1
a bending-type metal substrate 300... containing at least one material selected from among Al, Cu, Ag, Au, Cr, Mo, Mg, and Ni
Data Source
AI summary
A light source circuit unit and a lighting device including the light source circuit unit that are configured such that a bent-type metal substrate is formed on an upper surface of the printed circuit board so that the occurrence of a defect due to circuit damage at a bent part upon bending the substrate can be prevented, and slimness and a heat-dissipation property of a device can be improved. The light source circuit board includes: a substrate having a first part with at least one opening portion, and a second part bent from the first part; a printed circuit board on one surface of the substrate; and a light source element mounted to the printed circuit board and inserted into the opening portion, the light source element emitting light to an opposing side of the substrate.