Bent PCB Backlight Unit Spring Back Mitigation
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Solution Overview
Problem
Bent printed circuit boards used in backlight units suffer from a spring back phenomenon, leading to reduced adhesion and optical properties due to bowing, which affects the performance of light source devices like LEDs.
Innovation Solution
Incorporating through holes in the bending part of the bent printed circuit board to minimize the elastic force and reduce the spring back phenomenon, thereby maintaining the adhesion and optical properties of the LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the printed circuit board is bent to improve heat dissipation, then heat dissipation performance is improved, but spring back phenomenon occurs causing bowing that reduces adhesion and optical properties
Solution Approach 1:
The bending part of the printed circuit board is divided into multiple segments by forming through-holes that pass through the board. This segmentation reduces the continuous elastic force in the bending part, thereby minimizing the spring back phenomenon while preserving the heat dissipation benefits of the bent configuration
Solution Approach 2:
Through-holes are formed in the bending part of the printed circuit board, creating a porous structure that reduces the elastic force. These holes allow the board to maintain its bent shape more effectively by disrupting the continuous elastic recovery path, thus reducing bowing and improving adhesion and optical properties
2Area of stationary object
If the printed circuit board is bent to provide wider radiation area, then heat emission is improved, but bowing occurs due to spring back phenomenon
Solution Approach 1:
The bending part is segmented through the formation of multiple through-holes, which divide the continuous material into separate sections. This segmentation reduces the overall elastic force in the bending part, thereby minimizing spring back and the resulting bowing, while maintaining the desired L-shape and radiation area
Solution Approach 2:
The physical structure of the bending part is changed by introducing through-holes, which alter the mechanical parameters (elastic force, rigidity) of the board. This parameter change allows the board to maintain its bent shape with reduced bowing while preserving the wider radiation area for heat emission
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The holes formed in the bent part of the printed circuit board effectively reduce the bowing and elastic force, enhancing the adhesion and optical performance of the LEDs by minimizing the spring back effect.
Implementation Method 1
the bent printed circuit board may be varied by a spring back phenomenon... the holes formed in the bent part of the printed circuit board effectively reduce the bowing and elastic force, enhancing the adhesion and optical performance of the LEDs by minimizing the spring back effect
Data Source
AI summary
Provided is a bent printed circuit board for a backlight unit, including: a metal plate including a first part, a second part extending from the first part, and a bending part formed between the first part and the second part; an insulating layer on the metal plate; and through holes passing through at least one of the metal plate and the insulating layer and placed on the bending part.