Bent Heat-Radiating PCB Chassis Assembly for Backlight Thermal Management
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Solution Overview
Problem
Conventional heat-radiating printed circuit boards (PCBs) for backlight units face issues with heat transfer degradation due to thermal interface materials, difficulty in miniaturization, and limited control over dimming and scanning functions, as well as heat-related damage from electrode lines.
Innovation Solution
The integration of a heat-radiating PCB with a bent mounting unit onto a chassis, allowing for a divided driving unit with separate electrode lines on different planar surfaces, enhancing heat transfer and enabling fine control over illumination while reducing PCB width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the heat-radiating PCB and blanket are separately manufactured and bonded using TIM, then the structure is simplified and manufacturing is easier, but the heat transfer efficiency is degraded due to the TIM layer
Solution Approach 1:
The patent merges the heat-radiating PCB and blanket into a single integrated component. The PCB is formed with a bent mounting unit that directly contacts the chassis, eliminating the need for separate blanket and TIM components. This integration removes the thermal interface material layer that degrades heat transfer, while still maintaining manufacturing simplicity through the一体化 structure.
2Adaptability or versatility
If the driving unit is divided into three driving regions with multiple electrodes and electrode lines on the same planar surface, then dimming and scanning functions can be performed, but the PCB width increases and miniaturization becomes difficult
Solution Approach 1:
The patent utilizes the bent mounting unit to create a three-dimensional configuration where electrode lines are arranged on different planar surfaces. The mounting unit is bent at a specific angle, allowing electrode lines to be positioned on the bent surface rather than requiring additional width on the flat PCB surface. This dimensional transition enables segmented illumination control while maintaining a compact PCB width.
3Ease of manufacture
If electrode lines are formed on the same planar surface as the circuit pattern, then manufacturing is simpler, but heat generated by current flow damages the PCB and shortens its life
Solution Approach 1:
The patent positions electrode lines on the bent mounting unit surface, which is spatially separated from the flat circuit pattern surface. This dimensional separation allows electrode lines to be formed on a different planar surface that is physically distant from the main circuit board area, reducing heat transfer to the PCB and extending its lifespan while maintaining manufacturing simplicity through integrated formation processes.
4Ease of operation
If a blanket is separately prepared and bonded to the chassis, then the heat-radiating PCB can be mounted, but the TIM layer degrades the heat-radiating effect and reduces efficiency
Solution Approach 1:
The patent combines the mounting function directly into the PCB structure through the bent mounting unit. The mounting unit itself serves as the heat-radiating surface that contacts the chassis, eliminating the need for a separate blanket component and TIM layer. This integration maintains easy mounting capability while removing the thermal barrier that reduces heat radiation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves heat transfer efficiency, simplifies manufacturing, allows for miniaturization, and enables precise control over illumination by integrating the PCB and blanket, preventing heat damage and reducing material costs.
Implementation Method 1
a heat-radiating PCB (printed circuit board) and a chassis assembly having the same capable of integrating the heat-radiating PCB and a blanket for maximization of heat-radiating characteristics
Implementation Method 2
bonded using TIM (thermal interface material 20)
Data Source
AI summary
The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit; and one or more mounting units bent from the circuit pattern unit to be fixed at a chassis providing a lightguide path of a backlight unit, where the circuit pattern unit includes a driving unit divided into a plurality of driving regions and at least one or more electrodes for supplying a power to the driving unit, and where, the mounting unit is arranged with an electrode line for connecting the driving unit and electrodes other than the electrode arranged on the circuit pattern unit, such that dimming and scanning functions can be performed whereby illumination can be finely controlled, the width of the circuit pattern unit can be narrowed and damage to the PCB caused by heat can be prevented.