Bent PCB Light Source for Thin Backlight Modules

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Solution Overview

Problem

The thickness of display devices is hindered by the height of the backlight module, primarily due to the large height of the Printed Circuit Board (PCB) required for the light source, which includes components and wiring, making it difficult to achieve a thinner design.

Innovation Solution

A light source with a bent circuit board that integrates a light-emitting element and power components, where the circuit board is formed with a first bottom plate and side plate connected to form a bent shape, allowing the light-emitting element to be positioned on the side plate, reducing the need for extensive PCB height and incorporating a heat-dissipating aluminum substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional PCB with components and wiring is used to supply power for the light source, then the light source can be properly powered, but the height of the PCB increases, resulting in increased overall thickness of the backlight module and display device

Engineering Contradiction:
Improvepower supply reliabilityVSAvoidbacklight module thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent combines the circuit board with the heat dissipation structure into an integrated unit. The circuit board is formed with a bent shape where the first bottom plate serves as both a mounting surface for power components and a heat dissipation structure, eliminating the need for separate PCB and heat sink components, thus reducing overall thickness while maintaining power supply reliability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The circuit board transitions from a conventional flat structure to a bent three-dimensional structure. The first side plate extends vertically from the bottom plate, allowing the light-emitting element to be positioned on the side plate while power components are arranged on the bottom plate, effectively utilizing vertical space to reduce the horizontal footprint and overall module thickness

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If the circuit board is made taller to accommodate components and wiring, then power supply functionality is ensured, but the height of the light source increases, making it difficult to achieve thinner display devices

Engineering Contradiction:
Improvepower supply functionalityVSAvoidlight source height
Core Design Contradiction:
Ease of manufactureVSLength of moving object

Solution Approach 1:

The power supply components and circuit board are merged into a single integrated structure. The first bottom plate of the circuit board serves dual purposes as both a mounting platform for power components and a heat dissipation structure, eliminating the need for additional vertical space that would otherwise be required for separate component housings

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The bent configuration of the circuit board redistributes components in three-dimensional space. By positioning the light-emitting element on the vertically extended first side plate and arranging power components on the first bottom plate, the design utilizes vertical extension rather than increasing overall height, thereby reducing the light source height while maintaining manufacturing ease

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Length of stationary object

If a bent circuit board structure is used to reduce thickness, then the backlight module thickness is reduced, but the circuit board structure becomes more complex

Engineering Contradiction:
Improvebacklight module thicknessVSAvoidcircuit board structure
Core Design Contradiction:
Length of stationary objectVSDevice complexity

Solution Approach 1:

The circuit board and heat dissipation structure are merged into a single integrated component. The bent circuit board structure serves multiple functions simultaneously: it provides mechanical support, electrical connectivity, and thermal management, thereby reducing the number of separate components and simplifying the overall assembly process despite the non-planar geometry

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration lowers the overall thickness of the backlight module and display device while enhancing heat dissipation, thereby prolonging the service life of the light source and improving the display device's efficiency.

Implementation Method 1

the circuit board is an aluminum substrate

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS11340395B2Light source, backlight module and manufacturing method thereof, and display device
Publication Date: 2022.05.24 HEFEI BOE DISPLAY LIGHT
  • US11340395B2 patent drawing
  • US11340395B2 patent drawing
  • US11340395B2 patent drawing

AI summary

The present disclosure provides a light source, a backlight module and a manufacturing method thereof and a display device. The light source includes a light-emitting element and a circuit board supplying power for the light-emitting element, the circuit board includes a first bottom plate and a first side plate, the first bottom plate and the first side plate are connected to form a bent shape, and the light-emitting element is arranged on the first side plate and located on an identical side of the first side plate with the first bottom plate.