Bent Plate Frame for Power Conversion Device Pressurization
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Solution Overview
Problem
Existing power conversion devices face challenges in securing sufficient pressurizing force for stacked semiconductor modules and coolers while minimizing device size, as traditional methods require large cases or insufficient pressurizing forces due to the absence of spring members.
Innovation Solution
A power conversion device design featuring a frame with a first frame made of bent plate material acting as a spring member, sandwiching the stacked semiconductor modules and coolers, which eliminates the need for a high-stiffness case and ensures adequate pressurizing force, along with a manufacturing method that adjusts and applies pressurizing force accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pressed spring member is provided between the stacked body and a case, then adhesion between semiconductor modules and coolers is improved, but the size of the case and power conversion device increases
Solution Approach 1:
The patent merges the case and spring member into a single integrated structure. The case includes integrated pressing portions with elastic elements that directly press the stacked body, eliminating the need for a separate spring member. This integration maintains the necessary pressurizing force while reducing the overall case size.
Solution Approach 2:
The patent introduces recessed portions and protruding portions that extend in the stacking direction, utilizing the vertical dimension to create pressing action. The pressing portions extend from the case in the stacking direction to apply force to the stacked body, effectively using spatial arrangement to achieve pressurization without increasing case volume.
2Strength
If the case is designed with high stiffness to resist spring member reaction force, then the spring member can function properly, but the size of the case increases
Solution Approach 1:
The case is segmented into a body portion and multiple pressing portions with recessed regions. This segmentation allows localized flexibility at the pressing portions while maintaining overall case structural integrity. The elastic elements are positioned within recessed portions, allowing them to deform independently without requiring the entire case to be highly flexible.
Solution Approach 2:
The case and spring member functions are merged into a single integrated structure. The pressing portions of the case incorporate elastic elements that provide the spring function, eliminating the need for a separate spring member and reducing the case size while maintaining necessary stiffness.
3Volume of stationary object
If the spring member is omitted to reduce device size, then the case size is reduced, but the pressurizing force applied to the stacked body becomes insufficient
Solution Approach 1:
The case and spring member are merged into an integrated structure where the pressing portions of the case incorporate elastic elements. This integration maintains the pressurizing function while reducing the overall device size by eliminating separate components.
Solution Approach 2:
The elastic modulus and geometric parameters of the pressing portions are optimized to provide sufficient pressurizing force. The recessed portions and protruding portions are designed with specific dimensions and material properties that enable them to generate and maintain the required pressing force on the stacked body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively secures sufficient pressurizing force for the stacked body while reducing the size of the power conversion device, enabling high-accuracy assembly and improved cooling performance by using the frame's bending stiffness to maintain adhesion and prevent deformation.
Implementation Method 1
The first frame is a plate material bent to surround the stacked body from three directions... each of the wall surfaces of the first frame is bent like a plate spring... the first frame itself can serve as the spring member
Data Source
AI summary
A power conversion device includes a plurality of semiconductor modules, a plurality of coolers, and a frame. The frame pressurizes and holds a stacked body in which the semiconductor modules and the coolers are alternately stacked. The frame includes a first frame and a second frame that sandwich the stacked body therebetween. The first frame is a plate material bent to surround the stacked body from three directions, and includes a pair of side walls extending in the stacking direction of the stacked body, and an abutting wall extending between the side walls and abutting the stacked body. The abutting wall is bent outward from the frame. Each of the side walls is bent inward from the frame.


