Bent Fixing Plate Layout for Multi-Chip Liquid Ejecting Heads

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Solution Overview

Problem

Existing technologies have not adequately addressed the arrangement of multiple head chips on a single fixing plate, specifically in terms of the technical field of liquid ejecting heads and apparatuses, particularly in the ink jet system, where variations in arranging head chips on a fixing plate have not been sufficiently studied.

Innovation Solution

The liquid ejecting head is designed with a fixing plate that includes a first and second flat plate portion, each with a fixing surface for a head chip, where the surfaces face different directions, forming an angle greater than 180 degrees, and half-lines perpendicular to these surfaces do not intersect, allowing for improved alignment and separation of nozzle landing positions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple head chips are arranged parallel on a fixing plate as in related art, then the structure is simple, but the alignment precision and separation of nozzle landing positions are insufficient

Engineering Contradiction:
Improvealignment precision of head chipsVSAvoidfixing plate structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The fixing plate transitions from a planar arrangement to a three-dimensional bent structure, creating multiple surfaces at different angles. This dimensional change allows head chips to be positioned with precise spatial separation while maintaining a compact overall structure, resolving the contradiction between alignment precision and device complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The fixing plate is divided into multiple flat plate portions (first flat plate portion, second flat plate portion, etc.) that are bent at different angles. Each portion independently supports a head chip, enabling precise alignment control for each chip while keeping the overall structure integrated and manageable.

Inventive Principle:
Principle #1Segmentation

2Loss of time

If head chips are arranged to face the same direction on a flat plate, then the structure is simple, but the landing time difference between different head chips increases

Engineering Contradiction:
Improvedifference in landing timesVSAvoidfixing plate configuration
Core Design Contradiction:
Loss of timeVSDevice complexity

Solution Approach 1:

By bending the fixing plate to create multiple surfaces at different angles, the patent achieves precise control over the spatial positions and orientations of multiple head chips. This allows all head chips to be positioned at optimal distances from the medium, minimizing landing time differences while maintaining a unified integrated structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If the fixing plate is bent to form angles greater than 180 degrees, then the alignment and separation of head chips is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improvepositioning accuracy of head chipsVSAvoidfixing plate fabrication
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The fixing plate is segmented into multiple flat plate portions connected at bent portions. This segmentation allows each portion to be manufactured and positioned independently, then assembled into the final bent configuration, reducing overall manufacturing complexity while achieving precise positioning.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent specifies that bent portions have different thicknesses (first thickness for first bent portion, second thickness for second bent portion). This parameter variation optimizes both the structural integrity and the ease of manufacturing for each specific bent region, balancing precision requirements with fabrication feasibility.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20260001329A1Liquid Ejecting Head And Liquid Ejecting Apparatus
Publication Date: 2026.01.01 SEIKO EPSON CORP
  • US20260001329A1 patent drawing
  • US20260001329A1 patent drawing
  • US20260001329A1 patent drawing

AI summary

A liquid ejecting head includes a first head chip, a second head chip, and a fixing plate, in which the fixing plate includes a first flat plate portion including a first fixing surface to which the first head chip is fixed, and a first surface that is opposite from the first fixing surface, and a second flat plate portion including a second fixing surface to which the second head chip is fixed, and a second surface that is opposite from the second fixing surface, the first surface and the second surface are caused to face different directions from each other by bending the fixing plate, and in a view from a first direction along an intersection line between the first surface and the second surface, an angle formed between the first surface and the second surface is greater than 180 degrees.