Bent Power Line Patterns for EMI Reduction in Display Substrates
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Solution Overview
Problem
Conventional methods for reducing electromagnetic interference (EMI) in flat panel display systems, such as adding additional components or using separate filters, increase costs and do not completely eliminate EMI due to system board antenna effects.
Innovation Solution
An interconnection substrate with a flexible insulation base film featuring power, ground, and signal lines with bent patterns, such as zigzag, loop, or spiral designs, which increase inductance and capacitance, effectively reducing high-frequency noise and EMI by relaying signals between semiconductor chips and printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If additional components (ferrite core, inductor, capacitor) are added to reduce EMI, then EMI reduction is achieved, but product cost and development cost increase
Solution Approach 1:
The patent extracts the EMI filtering function from separate external components and integrates it directly into the power line trace design on the circuit board. The bent portion of the power line itself serves as the inductor, eliminating the need for separate inductor components while maintaining EMI reduction capability.
Solution Approach 2:
The patent merges the power transmission function and the EMI filtering function into a single integrated structure. The power line with bent portions simultaneously carries power signals and provides inductance for EMI reduction, combining multiple functions into one element.
2Object-affected harmful factors
If conventional EMI reduction methods are used, then some EMI reduction is achieved, but EMI cannot be completely eliminated due to system board antenna effects
Solution Approach 1:
The patent applies curvature to the power line trace by introducing bent portions with specific radii of curvature. This curvature creates inductance that opposes high-frequency noise currents, effectively reducing EMI radiation from the system board that would otherwise act as an antenna.
Solution Approach 2:
The patent changes the geometric parameters of the power line (length, curvature radius, bend angle) to optimize the inductance value. By adjusting these parameters, the power line's inherent inductance is tuned to provide effective EMI reduction across the relevant frequency range, addressing the incomplete EMI elimination problem.
3Object-affected harmful factors
If separate filter components are disposed between system board and display panel, then high-frequency noise filtering is improved, but product cost increases
Solution Approach 1:
The patent enables the power line to serve itself by designing the trace geometry to provide the necessary inductance for EMI filtering. The power line structure itself performs the filtering function without requiring separate filter components, making the system self-sufficient for EMI reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased inductance and capacitance of the bent line patterns stabilize semiconductor chip operation, reducing EMI levels without increasing manufacturing costs, thus enhancing the performance of flat panel display systems.
Implementation Method 1
the increased lengths of the power and ground lines due to line patterns having a plurality of bent portions may increase the inductances of the power and ground lines, thus reducing the transmission of high-frequency noise
Implementation Method 2
the power and ground lines may be relatively close to and parallel to each other, thus increasing the capacitance between the power and ground lines
Data Source
AI summary
Example embodiments relate to an interconnection substrate and a semiconductor chip package and a display system including the same. The interconnection substrate may include a base film, a signal line provided on the base film, a power line provided on the base film as a line pattern including a plurality of bent portions, and a ground line provided on the base film in parallel with the power line. The interconnection substrate may further include a semiconductor chip provided on the base film, wherein the power, ground, and/or signal lines are electrically connected to the semiconductor chip to form a semiconductor chip package. A display system may include the above semiconductor chip package, a screen displaying an image, and a PCB generating a signal. The semiconductor chip may be connected between the PCB and the screen and relay the generated signal from the PCB to the screen. Use of the power, ground, and/or signal lines having a plurality of bent portions may reduce electromagnetic interference (EMI) within the display system.