Bent Screw Terminal for Compact Semiconductor Device Packaging
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Solution Overview
Problem
Semiconductor devices used in inverters have varying circuit configurations and terminal arrangements, leading to differences in size and terminal placement, resulting in a larger overall device size and limited flexibility in layout adaptation.
Innovation Solution
A semiconductor device design featuring a semiconductor mounting substrate, mother case, securing members, screw terminal, and lid member, where the screw terminal is secured between adjacent securing members and bent to face the lid member, allowing for flexible terminal placement and reduced device size by utilizing the lid member's surface for external terminal connections, eliminating protrusion and enabling compact packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the screw terminal is connected outside the mother case in a plan view, then the screw terminal can be secured at a desired position in the rim of the mother case, but the size of the entire semiconductor device becomes large
Solution Approach 1:
The screw terminal is bent to face the lid member, moving the connection point from the outer rim area to the lid member surface area. This dimensional repositioning allows the terminal connection to utilize the vertical space above the mother case rather than extending the horizontal footprint, thereby reducing the overall device area while maintaining placement flexibility.
Solution Approach 2:
The screw terminal is inserted between adjacent securing members on the rim of the mother case, nesting the terminal structure within the existing case framework. The terminal then bends upward to connect to the lid member, effectively utilizing the vertical space within the device envelope rather than requiring additional horizontal space.
2Ease of operation
If the screw terminal protrudes outward from the mother case, then the terminal can be accessed for connection, but the overall device size increases
Solution Approach 1:
Instead of extending the terminal horizontally outward from the mother case, the terminal is bent to extend vertically upward to face the lid member. This changes the accessibility direction from horizontal to vertical, allowing terminal connection while minimizing the horizontal dimensions of the device.
3Adaptability or versatility
If different circuit configurations are used, then the semiconductor device can adapt to various applications, but the terminal arrangement and device size vary
Solution Approach 1:
The lid member serves multiple functions: it closes the opening of the mother case, provides a mounting surface for the bent screw terminal, and accommodates various terminal arrangements for different circuit configurations. This universal structure allows the same basic design to adapt to CIB, 7in1, 6in1, or 2in1 configurations without requiring fundamentally different terminal arrangements.
Data Source
AI summary
A semiconductor device includes a semiconductor mounting substrate, a mother case having an opening and housing the semiconductor mounting substrate, a plurality of securing members provided along a rim of the mother case, a screw terminal, and a lid member. The screw terminal has a flat plate portion, an insertion portion extending from the flat plate portion, and a terminal bottom portion, is secured to the securing members by insertion of the insertion portion between adjacent securing members, and is electrically connected to the semiconductor mounting substrate on the terminal bottom portion side. The lid member closes the opening with the screw terminal secured to the securing members. The screw terminal is bent such that the flat plate portion faces an upper surface of the lid member closing the opening. The semiconductor device that can achieve reduction in size of the entire device is obtained.