Bent Shield Plates for Semiconductor Magnetic Protection
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Solution Overview
Problem
Semiconductor devices are susceptible to external magnetic fields, and existing magnetic shields do not provide adequate protection, leading to interference with device operation.
Innovation Solution
A semiconductor device configuration featuring a substrate with a lower shield plate and an upper shield plate, both made of high-magnetic-permeability materials, with bent side walls that connect to form a magnetic shield to protect the semiconductor chip from external magnetic fields, while avoiding contact with bonding wires and connection members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a magnetic shield is used to reduce the influence of external magnetic fields, then the reliability of the semiconductor device is improved, but the device complexity increases due to the additional shield structure
Solution Approach 1:
The magnetic shield structure is integrated with the semiconductor device packaging structure. The shield plates are positioned to coincide with the housing boundaries, merging the protective function into the existing device architecture rather than adding separate components.
Solution Approach 2:
The shield plates serve multiple functions: they provide magnetic shielding, structural support, and define the physical boundaries of the device housing. This multi-functionality reduces the need for additional components and simplifies the overall device structure.
2Object-affected harmful factors
If the magnetic shield covers the entire semiconductor chip, then the magnetic shield effect is enhanced, but the ease of manufacture deteriorates due to difficulty in positioning around contact portions
Solution Approach 1:
The magnetic shield is divided into multiple separate plates (first shield plate, second shield plate, third shield plate) that can be independently manufactured and positioned. Each plate can be precisely placed to avoid contact portions while maintaining comprehensive coverage, simplifying the manufacturing process.
Solution Approach 2:
The shield plates are strategically positioned to provide magnetic shielding in specific critical areas while leaving contact portions exposed. The first shield plate avoids the first contact portion, the second shield plate avoids the second contact portion, and the third shield plate avoids the connection member, optimizing both shielding effectiveness and manufacturability.
3Ease of manufacture
If the magnetic shield structure is simplified, then the ease of manufacture is improved, but the magnetic shield effect deteriorates
Solution Approach 1:
Multiple shield plates are combined to form a comprehensive magnetic shielding system. The first, second, and third shield plates work together to provide coverage on multiple faces of the semiconductor chip, achieving enhanced shielding effect through a modular structure that remains easy to manufacture.
Solution Approach 2:
The magnetic shielding is extended from a single-plane structure to a multi-dimensional arrangement with shield plates positioned on different faces and orientations. This spatial distribution of shielding elements provides comprehensive protection while maintaining manufacturing simplicity through modular assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration significantly enhances the magnetic shield effect, effectively reducing the influence of external magnetic fields and ensuring the semiconductor device operates reliably.
Implementation Method 1
An example of a known magnetic shield used for a semiconductor device is an electromagnetic wave absorption mold resin that contains a high-magnetic-permeability material as a filler and that covers an upper surface and a side surface of a semiconductor chip so as to reduce the influence of an external magnetic field on the semiconductor device
Data Source
AI summary
A semiconductor device includes: a substrate on which a first contact portion is formed; a lower shield plate provided above the substrate to avoid the first contact portion and including a magnetic substance; a semiconductor chip provided above the lower shield plate and including a second contact portion electrically connected to the first contact portion, and a connection member that electrically connects the first contact portion and the second contact portion; and an upper shield plate provided above the semiconductor chip to avoid the second contact portion and the connection member and including a magnetic substance. An end of at least one of the lower shield plate and the upper shield plate is bent toward the other one of the lower shield plate and the upper shield plate so have a side wall portion whose tip is connected to the other one of the lower shield plate and the upper shield plate.