Shielding Bent Signal Lines with Mesh Ground Planes
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Solution Overview
Problem
Bent signal lines in computing devices, particularly those used in 5G RFICs, face challenges with electromagnetic interference (EMI) and crosstalk due to the orientation of antenna arrays in different directions, which can impact signal quality and coverage.
Innovation Solution
The implementation of a signal line structure with a mesh ground plane above and below the signal lines, connected by vias, provides shielding and flexibility, allowing for better antenna positioning and reduced EMI, while varying via density ensures rigidity and accuracy during bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If signal lines are bent to connect antenna arrays in different planes, then antenna coverage and positioning are improved, but electromagnetic interference and crosstalk increase
Solution Approach 1:
A mesh ground plane structure is introduced as an intermediary between the signal lines and the external electromagnetic environment. The mesh ground plane acts as a shield that blocks electromagnetic interference from reaching the bent signal lines, while allowing the signal lines to maintain their bent configuration for connecting antenna arrays in different planes.
Solution Approach 2:
The patent converts the potential harm of bent signal lines (which are more susceptible to EMI) by introducing the mesh ground plane structure. The mesh ground plane transforms the harmful electromagnetic interference into a blocked or redirected path, while the bent signal lines continue to provide the necessary flexibility for antenna positioning.
2Object-affected harmful factors
If mesh ground planes are added to shield signal lines, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The patent employs a mesh ground plane structure that functions as a thin, flexible shielding layer. This mesh structure provides effective electromagnetic interference protection while maintaining a relatively simple and thin profile, avoiding the need for bulky or complex shielding mechanisms.
3Object-affected harmful factors
If via density is increased to improve shielding, then electromagnetic interference protection is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by varying the via density in different regions of the mesh ground plane. Areas with higher EMI susceptibility receive higher via density for enhanced shielding, while areas requiring flexibility or already having adequate shielding receive lower via density. This localized approach optimizes both EMI protection and manufacturing feasibility without requiring uniform high-density vias throughout the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively shields bent signal lines from EMI, enhances antenna coverage, and maintains signal integrity by providing a flexible and rigid structure that supports accurate bending, thereby improving user experience under newer cellular standards.
Implementation Method 1
The shields may include a mesh ground plane above and below the signal lines to sandwich the signal lines therebetween
Implementation Method 2
The shields may further include vias connecting the mesh ground planes where the vias are positioned exteriorly of the signal lines
Data Source
AI summary
Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.