Bent Substrate Adhesive Bonding for Strain Reduction
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Solution Overview
Problem
Existing display devices face challenges in downsizing while minimizing strain at the bent portions, which is crucial for maintaining the display area size and device compactness.
Innovation Solution
The solution involves a display device configuration with a first and second substrate, each having a peripheral area that is bent in opposite directions and bonded together with an adhesive, reducing internal stress and strain at the bent portions by individually bending and then bonding the substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a flexible wiring substrate is bent to downsize the device, then the device size is reduced, but strain is generated at the bent portion
Solution Approach 1:
The invention divides the substrate into multiple separate substrates (first substrate and second substrate) that are bonded together. By bending each substrate individually and then bonding them, the strain that would occur in a single bent substrate is distributed across multiple components, reducing the overall strain at the bent portion while achieving device downsizing.
2Stress or pressure
If substrates are bent individually and then bonded, then strain at bent portions is reduced, but device complexity increases
Solution Approach 1:
The invention combines multiple substrates (first substrate and second substrate) into a single integrated structure through bonding. This merging approach allows each substrate to be bent individually to reduce strain, while the combined structure functions as a unified component, preventing the device complexity from becoming a limiting factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a more compact display device design with reduced strain at the bent portions, maintaining the display area size and minimizing internal stresses in the adhesive, thus enhancing the device's structural integrity and compactness.
Implementation Method 1
a first adhesive outside the first filler. The first adhesive bonds the first peripheral area and the second peripheral area
Data Source
AI summary
A display device includes a first substrate having a display area and a first peripheral area, a second substrate having a second peripheral area, a first filler between the first substrate and the second substrate, and a first adhesive outside the first filler. The first adhesive bonds the first peripheral area and the second peripheral area. The first substrate has a first bent portion in the first peripheral area. The second substrate has a second bent portion in the second peripheral area.


