Bent Substrate Light Source Module for Edge-Type Backlight Heat Dissipation
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Solution Overview
Problem
Edge-type backlight units face inefficiencies in heat dissipation and structural instability due to limited mounting area and heat transfer mechanisms, leading to potential separation of light emitting device packages.
Innovation Solution
A light source module with a substrate featuring a groove portion and a bent structure, allowing for enhanced heat transfer to a housing and improved mounting stability, includes light emitting devices mounted on a circuit portion with alternating electrode pads and a protrusion portion for reflective purposes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a lead frame is provided at a lateral surface of a light emitting device package for mounting on a substrate in edge-type backlight units, then the backlight unit achieves a slimmed structure, but heat dissipation efficiency deteriorates and structural stability deteriorates
Solution Approach 1:
The substrate is bent along a groove portion to form a three-dimensional configuration, transitioning from a flat two-dimensional mounting surface to a folded structure. This dimensional change allows the light emitting device package to be mounted on the bent substrate, increasing the effective mounting area while maintaining the slimmed profile of the backlight unit. The bent substrate creates additional surface area for heat dissipation and provides structural reinforcement.
Solution Approach 2:
The substrate is divided into multiple regions by the groove portion, creating distinct functional areas. The groove portion acts as a segmentation feature that allows the substrate to be folded into different planes, enabling the light emitting device package to be mounted at an angle relative to the main substrate plane. This segmentation increases the effective mounting area and improves both heat dissipation and structural stability.
2Volume of moving object
If a lead frame is provided at a lateral surface of a light emitting device package for mounting on a substrate in edge-type backlight units, then the backlight unit achieves a slimmed structure, but structural stability deteriorates due to limited mounting area
Solution Approach 1:
The substrate is bent along a groove portion to form a three-dimensional configuration, transitioning from a flat two-dimensional mounting surface to a folded structure. This dimensional change allows the light emitting device package to be mounted on the bent substrate, increasing the effective mounting area while maintaining the slimmed profile of the backlight unit. The bent substrate creates additional surface area for heat dissipation and provides structural reinforcement.
Solution Approach 2:
The substrate is divided into multiple regions by the groove portion, creating distinct functional areas. The groove portion acts as a segmentation feature that allows the substrate to be folded into different planes, enabling the light emitting device package to be mounted at an angle relative to the main substrate plane. This segmentation increases the effective mounting area and improves both heat dissipation and structural stability.
3Device complexity
If light emitting devices are mounted on a flat substrate in edge-type backlight units, then the structure is simple, but heat dissipation efficiency deteriorates due to limited contact area with the housing
Solution Approach 1:
The substrate is bent along a groove portion to form a three-dimensional configuration, transitioning from a flat two-dimensional mounting surface to a folded structure. This dimensional change allows the light emitting device package to be mounted on the bent substrate, increasing the effective mounting area while maintaining the slimmed profile of the backlight unit. The bent substrate creates additional surface area for heat dissipation and provides structural reinforcement.
Solution Approach 2:
The substrate is divided into multiple regions by the groove portion, creating distinct functional areas. The groove portion acts as a segmentation feature that allows the substrate to be folded into different planes, enabling the light emitting device package to be mounted at an angle relative to the main substrate plane. This segmentation increases the effective mounting area and improves both heat dissipation and structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency and structural reliability by increasing the mounting area and preventing contact between light emitting devices and the light guide panel, while also improving light emission efficiency and luminance through reflective and diffusive components.
Implementation Method 1
heat generated by the light emitting device package may be transferred to the substrate through the lateral surface thereof
Implementation Method 2
improving light emission efficiency and luminance through reflective and diffusive components
Data Source
AI summary
A light source module is provided. The light source module includes a substrate having a first surface on which a circuit portion is disposed, and a second surface disposed opposite thereto. The light source module further includes a plurality of light emitting devices mounted on the first surface of the substrate and electrically connected to the circuit portion, wherein the substrate is provided with a groove portion in the second surface thereof, and has a structure bent along the groove portion.