Integrated Sensor Unit with Bent Substrate for Compact Cell Culture Analysis
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Solution Overview
Problem
Conventional cell culture analysis devices require a large number of sensors for multiple culture vessels, leading to a bulky device due to the need for separate fixation and wiring of each sensor.
Innovation Solution
The sensor unit is formed by cutting out sensors from a substrate, leaving a bent portion on the substrate, eliminating the need for additional fixation components and allowing for a more compact design by integrating the sensors and wiring directly onto the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional sensor fixation method with separate components and lead wires is used, then the sensor can be properly connected and function reliably, but the device size increases and becomes bulky
Solution Approach 1:
The patent combines the sensor, wiring, and fixation structure into a single integrated substrate. The sensor is formed by cutting out from the substrate while leaving a bent portion that serves as both the fixation anchor and the electrical connection point, eliminating the need for separate fixation components and lead wires.
Solution Approach 2:
The bent portion of the substrate serves multiple functions simultaneously: it acts as the fixation component to secure the sensor, provides the wiring connection path, and maintains electrical connectivity. This multi-functional design reduces the number of separate components needed.
2Adaptability or versatility
If multiple sensors are used for multiple culture vessels, then comprehensive cell culture analysis is enabled, but the device complexity and size increase
Solution Approach 1:
The substrate is divided into multiple sensor regions, each with its own bent portion for fixation. This segmentation allows multiple sensors to be arranged on a single substrate, enabling comprehensive monitoring of multiple culture vessels while maintaining a compact, organized structure.
Solution Approach 2:
Multiple sensors are integrated onto a single substrate layer, with each sensor nested within the same planar structure. The bent portions of multiple sensors can be arranged in a compact pattern, reducing overall device complexity compared to separate sensor assemblies.
Data Source
AI summary
A sensor unit (9) comprises a substrate (13) having a sensor (16), wiring (19) connected to the sensor (16), connection portions (20a, 20b) connected to the sensor (16) via the wiring (19), and a bent portion (17) where the sensor (16) is bent downward. The sensor (16) is formed so as to be cut out from the substrate (13) in a state in which the bent portion (17) remains on the substrate (13).


