Bent Terminal Lead Frame for Electronic Module Warping Prevention
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Solution Overview
Problem
Conventional electronic modules with stacked electronic elements face an increase in size and warping or distortion due to terminal connections during heat treatment processes, such as soldering or reflow, which complicates the formation of circuit patterns and substrate stability.
Innovation Solution
The electronic module design incorporates a lead frame with first and second terminal parts that are bent and connected to respective conductor layers on substrates, allowing for a sealing resin to encapsulate these elements and terminal parts, maintaining a specific thickness distance to prevent substrate warping and distortion, while enabling the use of both substrates for circuit formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the plurality of electronic elements are stacked in layers to reduce size, then the volume of the electronic module is reduced, but the size in planar direction increases due to terminal connections
Solution Approach 1:
The patent transitions from planar terminal connections to three-dimensional bent terminal connections. The terminals are bent in the thickness direction to connect to conductor layers on opposite sides of the sealing resin, utilizing the third dimension (vertical space) rather than expanding in the planar direction. This allows compact planar footprint while maintaining electrical connectivity through vertical bending of terminal parts.
2Reliability
If the size of the first substrate and the second substrate increase to accommodate terminal connections, then the electrical connection is achieved, but the substrates may be warped or distorted in heat treatment process
Solution Approach 1:
The terminal parts are pre-bent into their final three-dimensional configuration before the heat treatment process. This preliminary shaping ensures that during soldering or reflow, the terminals maintain their bent shape and apply minimal additional stress to the substrates, preventing warping or distortion that would occur if terminals were straight and required significant deformation during assembly.
Solution Approach 2:
The patent changes the geometric parameters of the terminal parts by bending them in the thickness direction. This parameter change transforms the terminals from straight linear connections to three-dimensional bent connections, allowing electrical connectivity without requiring large planar substrate areas, thereby maintaining substrate stability during heat treatment.
3Area of stationary object
If the terminal parts are bent in the thickness direction, then the planar size is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent merges the terminal part structure with the lead frame by integrating the bent terminal parts directly into the lead frame body. This consolidation eliminates the need for separate terminal components and simplifies manufacturing, as the bent terminals are formed as an integral part of the lead frame structure rather than being assembled separately.
Data Source
AI summary
An electronic module has a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 and a second terminal part 120. The first terminal part 110 has a first terminal base end part 111, a first terminal outer part 113, and a first bending part 112 that is provided between the first terminal base end part 111 and the first terminal outer part 113 and that is bent toward the other side on a side of the first terminal base end part 111. The second terminal part 120 has a second terminal base end part 121, a second terminal outer part 123, and a second bending part 122 that is provided between the second terminal base end part 121 and the second terminal outer part 123 and that is bent toward one side on a side of the second terminal base end part 121.